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A DSM design flow: putting floorplanning, technology-mapping, and gate-placement together
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Source Annual ACM IEEE Design Automation Conference archive
Proceedings of the 35th annual Design Automation Conference table of contents
San Francisco, California, United States
Pages: 128 - 134  
Year of Publication: 1998
ISBN:0-89791-964-5
Authors
Amir H. Salek  Department of Electrical Engineering - Systems, University of Southern California, Los Angeles, CA
Jinan Lou  Department of Electrical Engineering - Systems, University of Southern California, Los Angeles, CA
Massoud Pedram  Department of Electrical Engineering - Systems, University of Southern California, Los Angeles, CA
Sponsors
SIGDA: ACM Special Interest Group on Design Automation
EDAC : Electronic Design Automation Consortium
IEEE-CS : Computer Society
Publisher
ACM  New York, NY, USA
Bibliometrics
Downloads (6 Weeks): 4,   Downloads (12 Months): 13,   Citation Count: 13
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ABSTRACT

This paper presents an integrated design flowwhich combines floorplanning, technology mapping, andplacement using a dynamic programming algorithm. Theproposed design flow consists of five steps: maximum treesub-structure formation, levelized cluster tree construction,minimum area implementation using 2-D shape functions,critical path identification, and repeated application ofsimultaneous floorplanning, technology mapping and gateplacement along the timing critical paths. Experimentalresults obtained from an extensive set of benchmarksdemonstrate the effectiveness of the proposed flow.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
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J. Lou, A. H. Salek, and M. Pedram,"An integrated flow for technology remapping and placement of sub-half-micron circuits," In Proceedings of Axa and South Pacific Design Automation Conference, pages 295-300, February 1998.
 
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H. Murata, K. Fujiyoshi, S. Nakatake, and Y. Kajitani,"VLSI module placement based on rectangle packing by the sequence-pair," IEEE. Transactions on Computer-Aided Design of Integrated Circuits and Systems, 15(12), pages 1518-1524, December 1996.
 
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A. H. Salek, J. Lou, and M. Pedram "Simultaneous floorplanning, technology mapping, and gate-placement for deep submicron designs," University of Southern California Technical Report, 1997.
 
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E. M. Sentovich, K. J. Singh, L. Lavagno, C. Moon, R. Murgai, A.Saldanha, H. Savoj, P. R. Stephan, R. K. Brayton, and A. Sangiovanni- Vincentelli" SIS: A system for sequential circuit synthesis", Memorandum No UCB/ERL M92/41 ,Electronics Research Laboratory, College of Engineering, University of California, Berkeley, CA 94720, May 1992.
 
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CITED BY  13

Collaborative Colleagues:
Amir H. Salek: colleagues
Jinan Lou: colleagues
Massoud Pedram: colleagues