ACM Home Page
Please provide us with feedback. Feedback
Multilevel integral equation methods for the extraction of substrate coupling parameters in mixed-signal IC's
Full text PdfPdf (529 KB)
Source Annual ACM IEEE Design Automation Conference archive
Proceedings of the 35th annual Design Automation Conference table of contents
San Francisco, California, United States
Pages: 20 - 25  
Year of Publication: 1998
ISBN:0-89791-964-5
Authors
Mike Chou  Department of EECS, Massachusetts Institute of Technology, Cambridge, MA
Jacob White  Department of EECS, Massachusetts Institute of Technology, Cambridge, MA
Sponsors
SIGDA: ACM Special Interest Group on Design Automation
EDAC : Electronic Design Automation Consortium
IEEE-CS : Computer Society
Publisher
ACM  New York, NY, USA
Bibliometrics
Downloads (6 Weeks): 2,   Downloads (12 Months): 9,   Citation Count: 4
Additional Information:

abstract   references   cited by   index terms   collaborative colleagues  

Tools and Actions: Request Permissions Request Permissions    Review this Article  
DOI Bookmark: Use this link to bookmark this Article: http://doi.acm.org/10.1145/277044.277049
What is a DOI?

ABSTRACT

The extraction of substrate coupling resistances can be formulated as a first-kind integral equation, which requires only discretization of the two-dimensional contacts. However, the result is a dense matrix problem which is too expensive to store or to factor directly. Instead, we present a novel, multigrid iterative method which converges more rapidly than previously applied Krylov-subspace methods. At each level in the multigrid hierarchy, we avoid dense matrix-vector multiplication by using moment-matching approximations and a sparsification algorithm based on eigendecomposition. Results on realistic examples demonstrate that the combined approach is up to an order of magnitude faster than a Krylov-subspace method with sparsification, and orders of magnitude faster than not using sparsification at all.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
1
A. Brandt. Multi-level adaptive solutions to boundary-value problems. Mathematics of Computation, 31 (I 38):333-390, April 1977.
 
2
 
3
4
 
5
R. Gharpurey and R.G. Meyer. Modeling and analysis of substrate coupling in integrated circuits. InlEEE 1995 Custom Integrated Circuits Conference, pages 125-128, 1995.
 
6
Ranjit Gharpurey. ModelingandAnalysisofSubstrateCoupling in Integrated Circuits,PhD thesis, Department of Electrical Engineering and Computer Science, University of California at Berkeley, Berkeley, CA, June 1995.
 
7
Ranjit Gharpurey and Robert G. Meyer. Modeling and analysis of substrate coupling in integrated circuits.IEEE Journal Solid-StateCircuits, 31(3):344-353, March 1996.
 
8
L. Greengard. The Rapid Evaluation of Potential Fields in ParticleSystems. M.I.T. Press, Cambridge, Massachusetts, 1988.
 
9
W. Hackbusch. Multi-Grid Methods and Applications. Springer-Verlag, Berlin Heidelberg New York Tokyo, 1985.
 
10
 
11
T. A. Johnson, R.W. Knepper, V. Marcellu, and W. Wang. Chip substrate resistance modeling technique for integrated circuit design. IEEE Transactions on Computer-Aided Design oflntegratedCircuits, CAD-3(2): 126-134, 1984.
 
12
R. Kress. Linear IntegralEquations. Springer-Verlag, 1989.
 
13
Sujoy Mitra, R. A. Rutenbar, L. R. Carley, and D. J. Allstot. A methodology for rapid estimation of substrate-coupled switching noise. In IEEE1995CustomlntegratedCircuits Conference, pages 129-132, 1995.
 
14
K. Nabors and J. White. Fastcap: A Multipole Accelerated 3-D Capacitance Extraction Program.IEEE Transactions on Computer-AidedDesign, pages 1447-1459, November 1991.
 
15
Bram Nauta and Gian Hoogzaad. How to deal with substrate noise in analogcmos circuits. In European Conference on Circuit Theory and Design, pages Late 12: 1-6, Budapest, Hungary, September 1997.
 
16
V. Rohklin. Rapid solution of integral equation of classical potential theory. J. Comput. Phys., 60:187-207, 1985.
 
17
 
18
A. H. Schatz, ~. Thom6e, and W. L. Wendland. Mathematical TheoryofFiniteandBoundaryElementMethods. Birkh~iuser Verlag, Basel/Boston/Berlin, 1990.
 
19
 
20
B.R. Stanisic, N.K. Verghese, R.A. Rutenbar, L.R. Carley, and D.J. Allstot. Addressing substrate coupling in mixed-mode ic's: Simulation and power distribution synthesis.ZEEEJSSC, 29(3):226-238, March 1994.
 
21
J. Stoer and R. Bulirsch.lntroductiontoNumericalAnalysis. Spring,?-Verlag, second edition, 1993.
 
22
D.K. ~u, M.J. Loinaz, S. Masui, and B.A. Wooley. Experimental results and modeling techniques for substrate noise in mixed-signal integrated circuits. IEEEJSSC, 28(4):420430, April 1993.
 
23
Nishath Verghese. Extraction and Simulation Techniques for Substrate-Coupled Noise in Mixed-Signal Integrated Circuits. PhD thesis, Department of Electrical and Computer Engineering, Carnegie Mellon University, Pittsburgh, PA, August 1995.
 
24
Nishath K. Verghese, David J. Allstot, and Mark A. Wolfe. Verification techniques for substrate coupling and their application to mixed-s~gnal ic design. IEEE Journal Solid-State Circuits, 31 (3):354--365, March 1996.
25