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CHDStd—application support for reusable hierarchical interconnect timing views
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Source International Symposium on Physical Design archive
Proceedings of the 1998 international symposium on Physical design table of contents
Monterey, California, United States
Pages: 75 - 79  
Year of Publication: 1998
ISBN:1-58113-021-X
Authors
S. Grout  SEMATECH, 2706 Montopolis Dr, Austin, TX
G. Ledenbach  SEMATECH, 2706 Montopolis Dr, Austin, TX
R. G. Bushroe  SEMATECH, 2706 Montopolis Dr, Austin, TX
P. Fisher  SEMATECH, 2706 Montopolis Dr, Austin, TX
D. Cottrell  Silicon Integration Initiative, 4030 W. Braker Ln, Suite 550, Austin, TX
D. Mallis  Silicon Integration Initiative, 4030 W. Braker Ln, Suite 550, Austin, TX
S. DasGupta  IBM Corporation, 11400 Burnett Rd., Austin, TX
J. Morrell  IBM Corporation, B/334-2, East Fishkill, New York
Amrich Chokhavtia  SEMATECH, 2706 Montopolis Dr, Austin, TX
Sponsors
IEEE-CS : Computer Society
IEEE-CAS : Circuits & Systems
SIGDA: ACM Special Interest Group on Design Automation
Publisher
ACM  New York, NY, USA
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ABSTRACT

This paper describes an important new facility for timing-driven design applications within the new CHDStd standard for a SEMATECH design system for large complex chips. We first review EDA requirements for CHDStd hierarchy for large complex leading edge chips and current EDA problems in accurately and efficiently handling complex interconnect. We then describe our approach for fully-reusable hierarchical interconnect timing views in support of timing driven design for 0.25µ technologies and below. The result is a method which builds on SEMATECH's new controlled error parasitic timing calculation capability for deep submicron, providing means for compactly storing and reusing accurate hierarchical timing views for 28M to 100M transistor chip designs.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
1
The National Technology Roadmap for Semiconductors, pp 5-43. Semiconductor industry Association (SIA), 1994
 
2
3
 
4
Requirements Document- SEMATECH ECAD Program CHDS Technical Data (CIIDStd) - Rcqu/mments for a Chip I-Iicrarckical Product Design Specification Needed to Support 0.25-micron Chip Design. SEMATECH, October 6, 1995
 
5
Chip Hierarchical Design System - Integrated Hierarchical Forward Timing Driven Electrical and Physical Design Requirements for 02.S-micron Chip Design, Version 1.0. SEMATECH, February 21, 1996
 
6
An Integrated Dam Model for HicrarchicaIDesign Assembly, May 31, 1996, published jointly by IBM and CH - www.cfi.org/CIIDStdYmfomodsl
 
7
CHDStd information Model Documentation, April I0, 1996, published by CH-www.cfi.org/CHDStd/chdsIndcx~tml
 
8
EDA Industry Standards Roadmap for Design and Test, Version 1.0, published jointly by EDAC, CH, and SEMATECI-I, January 15,1996
 
9
V. Chandmmouli, Ram Swaminathan, Chi-Yuan Lo, Nagaraj NS, Jesse In, Wai-kai-sun, Don Cottmll. An Integrated Approach for Net Parasitic Extraction, Tau-97 Interconnect Workshop, December 4-5, 1997

Collaborative Colleagues:
S. Grout: colleagues
G. Ledenbach: colleagues
R. G. Bushroe: colleagues
P. Fisher: colleagues
D. Cottrell: colleagues
D. Mallis: colleagues
S. DasGupta: colleagues
J. Morrell: colleagues
Amrich Chokhavtia: colleagues