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A roadmap of CAD tool changes for sub-micron interconnect problems
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Source International Symposium on Physical Design archive
Proceedings of the 1997 international symposium on Physical design table of contents
Napa Valley, California, United States
Pages: 104 - 109  
Year of Publication: 1997
ISBN:0-89791-927-0
Author
Lou Scheffer  Cadence Design Systems
Sponsor
SIGDA: ACM Special Interest Group on Design Automation
Publisher
ACM  New York, NY, USA
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