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IES3: a fast integral equation solver for efficient 3-dimensional extraction
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Source International Conference on Computer Aided Design archive
Proceedings of the 1997 IEEE/ACM international conference on Computer-aided design table of contents
San Jose, California, United States
Pages: 448 - 455  
Year of Publication: 1997
ISBN:0-8186-8200-0
Authors
Sharad Kapur  Bell Laboratories, Lucent Technologies, Murray Hill, NJ
David E. Long  Bell Laboratories, Lucent Technologies, Murray Hill, NJ
Sponsors
SIGDA: ACM Special Interest Group on Design Automation
IEEE-CS : Computer Society
Publisher
IEEE Computer Society  Washington, DC, USA
Bibliometrics
Downloads (6 Weeks): 4,   Downloads (12 Months): 24,   Citation Count: 29
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ABSTRACT

Integral equation techniques are often used to extract models of integrated circuit structures. This extraction involves solving a dense system of linear equations, and using direct solution methods is prohibitive for large problems. In this paper, we present IES/sup 3/ (pronounced "ice cube"), a fast Integral Equation Solver for three-dimensional problems with arbitrary kernels. Extraction methods based on IES/sup 3/ are substantially more efficient than existing multipole-based approaches.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
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L. Greengard and V. Rohklin. A new version of the fast multipole method for the Laplace equation in three dimensions. Technical Report YALEU/DCS,/RR-1115, Yale University Department of Computer Science, September 1996.
 
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K. Nabors and J. White. Fastcap: A multipoleaccelerated 3-d capacitance extraction program. IEEE Transactions on Computer-Aided Design, 10(10):1447-1459, November 1991.
 
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K. Nabors and J. White. Multipole-accelerated capacitance extraction for 3-d structures with multiple dielectrics. IEEE Transactions on Circults and Systems, 39(11):946-954, November 1992.
 
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S. M. Rao, T. K. Sarkar, and R. F. Harrington. The electrostatic field of conducting bodies in multiple dielectric media. IEEE Transactions on Microwave Theory and Techniques, 32(11):1441- 1448, November 1984.
 
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J. Stoer and R. Bulirsch. Introduction to Numerical Analysis. Springer-Verlag, New York, 1979.
 
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W. T. Weeks. Calculation of coefficients of capacitance of multiconductor transmission lines in the presence of a dielectric interface. IEEE Transactions on Microwave Theory and Techniques, 18(1):35-43, January 1970.

CITED BY  29

Collaborative Colleagues:
Sharad Kapur: colleagues
David E. Long: colleagues