| Analysis and justification of a simple, practical 2 1/2-D capacitance extraction methodology |
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Annual ACM IEEE Design Automation Conference
archive
Proceedings of the 34th annual Design Automation Conference
table of contents
Anaheim, California, United States
Pages: 627 - 632
Year of Publication: 1997
ISBN:0-89791-920-3
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Authors
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Jason Cong
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UCLA, Computer Science Dept., Los Angeles, CA
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Lei He
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UCLA, Computer Science Dept., Los Angeles, CA
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Andrew B. Kahng
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Cadence Design Systems, Inc., San Jose, CA
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David Noice
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Cadence Design Systems, Inc., San Jose, CA
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Nagesh Shirali
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Cadence Design Systems, Inc., San Jose, CA
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Steve H.-C. Yen
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Cadence Design Systems, Inc., San Jose, CA
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Downloads (6 Weeks): 3, Downloads (12 Months): 31, Citation Count: 13
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ABSTRACT
This paper addresses post-routing capacitance extraction duringperformance-driven layout.We first show how basic driversin process technology (planarization and minimum metal densityrequirements) actually simplify the extraction problem; wedo this by proposing and validating five "foundations" throughdetailed experiments with representative 0.18¿m process parametersand a 3-D field solver.We then present a simple yetaccurate 2 1/2-D extraction methodology directly based on thefoundations.This methodology has been productized and isbeing shipped with the Cadence Silicon Ensemble 5.0 product.We conclude that the 2 1/2-D approach has sufficient accuracyfor current and near-term process generations.
REFERENCES
Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.
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N. D. Arora, K. V. Raol, R. Schumann, and L. M. Richardson, "Modeling and Extraction of Interconnect Capacitances for Multilayer VLSI Circuits," IEEE Trans. on Computer-Aided Design, vol. 15, no. 1, Jan., 1996, pp. 58-67.
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E. Barke, "Line-to-Ground Capacitance Calculation for VLSI: A Comparison," IEEE Trans. on Computer-Aided Design, vol. 7, no. 2, 1988, pp. 295-298.
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M. Basel, "Accurate and Efficient Extraction of Interconnect Circuits for Full-Chip Timing Analysis," Proc. WESCON, pp. 118-123, 1995.
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J. Chern, J. Huang, L. Aldredge, P. Li and P. Yang, "Multilevel Metal Capacitance Models for Interconnect Capacitances," IEEE Electron Device Lett, vol. EDL-14, pp. 32-43, 1992.
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U. Choudhury and A. Sangiovanni-Vincentelli, "Automatic Generation of Analytical Models for Interconnect Capacitances," IEEE Trans. on Computer-Aided Design, vol. 14, no. 4, April, 1995, pp. 470-480.
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J. Cong, L. He, A. B. Kahng, D. Noice, N. Shirali and S. H.-C. Yen, "Analysis and Justification of a Simple, Practical 2 1/2-D Capacitance Extraction Methodology", UCLA Computer Science Dept. Tech. Report CSD-970013, 1997 (available at http://b allade.cs.ucla.edu/-helei / public at ions. ht ml ).
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R. Guerrieri and A. Sangiovanni-Vincentelli, "Three-Dimensional Capacitance Evaluation on a Connection Machine," IEEE Trans. on Computer-Aided Design, vol. 7, pp. 1125-1133, 1988.
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K. Nabors and J. White, "Fastcap: A Multipole Accelerated 3-D Capacitance Extraction Program," IEEE Trans. on Computer-Aided Design, vol. 10, no. 11, Nov. 1991, pp. 1447-1459.
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Z. Ning and P. M. Dewilde, "SPIDER - Capacitance Modeling for VLSI Interconnections," IEEE Trans. on Computer-Aided Design, vol. 7, no. 12, pp. 1221-1228, Dec. 1988.
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T. Sakurai, "Closed-Form Expressions for Interconnect Delay, Coupling, Crosstalk in VLSI's," IEEE Trans. on Electron Devices, vol. ED-40, pp. 118-124, 1993.
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A. Seidl, A. Svoboda, J. Oberndorfer, and W. Rosner, "CAPCAL - A 3D Capacitance Solver for Support of CAD Systems," IEEE Trans. on Computer-Aided Design, vol. 7, no. 11, 1988, pp. 549- 556.
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S. Yen and N. Shirali, "Capacitance Extraction", Cadence Design Systems Application Note, 1995.
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Semiconductor Industry Association, National Technology Roadmap for Semiconductors, 1994.
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CITED BY 13
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Joon-Seo Yim , Seong-Ok Bae , Chong-Min Kyung, A floorplan-based planning methodology for power and clock distribution in ASICs, Proceedings of the 36th ACM/IEEE conference on Design automation, p.766-771, June 21-25, 1999, New Orleans, Louisiana, United States
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Jason Cong , Lei He , Cheng-Kok Koh , Zhigang Pan, Global interconnect sizing and spacing with consideration of coupling capacitance, Proceedings of the 1997 IEEE/ACM international conference on Computer-aided design, p.628-633, November 09-13, 1997, San Jose, California, United States
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P. Vancorenland , G. Van der Plas , M. Steyaert , G. Gielen , W. Sansen, A layout-aware synthesis methodology for RF circuits, Proceedings of the 2001 IEEE/ACM international conference on Computer-aided design, November 04-08, 2001, San Jose, California
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A. B. Kahng , S. Muddu , E. Sarto , R. Sharma, Interconnect tuning strategies for high-performance ICs, Proceedings of the conference on Design, automation and test in Europe, p.471-478, February 23-26, 1998, Le Palais des Congrés de Paris, France
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