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Analysis and justification of a simple, practical 2 1/2-D capacitance extraction methodology
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Source Annual ACM IEEE Design Automation Conference archive
Proceedings of the 34th annual Design Automation Conference table of contents
Anaheim, California, United States
Pages: 627 - 632  
Year of Publication: 1997
ISBN:0-89791-920-3
Authors
Jason Cong  UCLA, Computer Science Dept., Los Angeles, CA
Lei He  UCLA, Computer Science Dept., Los Angeles, CA
Andrew B. Kahng  Cadence Design Systems, Inc., San Jose, CA
David Noice  Cadence Design Systems, Inc., San Jose, CA
Nagesh Shirali  Cadence Design Systems, Inc., San Jose, CA
Steve H.-C. Yen  Cadence Design Systems, Inc., San Jose, CA
Sponsors
EDAC : Electronic Design Automation Consortium
IEEE-CAS : Circuits & Systems
SIGDA: ACM Special Interest Group on Design Automation
Publisher
ACM  New York, NY, USA
Bibliometrics
Downloads (6 Weeks): 1,   Downloads (12 Months): 28,   Citation Count: 13
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ABSTRACT

This paper addresses post-routing capacitance extraction duringperformance-driven layout.We first show how basic driversin process technology (planarization and minimum metal densityrequirements) actually simplify the extraction problem; wedo this by proposing and validating five "foundations" throughdetailed experiments with representative 0.18¿m process parametersand a 3-D field solver.We then present a simple yetaccurate 2 1/2-D extraction methodology directly based on thefoundations.This methodology has been productized and isbeing shipped with the Cadence Silicon Ensemble 5.0 product.We conclude that the 2 1/2-D approach has sufficient accuracyfor current and near-term process generations.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
1
N. D. Arora, K. V. Raol, R. Schumann, and L. M. Richardson, "Modeling and Extraction of Interconnect Capacitances for Multilayer VLSI Circuits," IEEE Trans. on Computer-Aided Design, vol. 15, no. 1, Jan., 1996, pp. 58-67.
 
2
E. Barke, "Line-to-Ground Capacitance Calculation for VLSI: A Comparison," IEEE Trans. on Computer-Aided Design, vol. 7, no. 2, 1988, pp. 295-298.
 
3
M. Basel, "Accurate and Efficient Extraction of Interconnect Circuits for Full-Chip Timing Analysis," Proc. WESCON, pp. 118-123, 1995.
 
4
J. Chern, J. Huang, L. Aldredge, P. Li and P. Yang, "Multilevel Metal Capacitance Models for Interconnect Capacitances," IEEE Electron Device Lett, vol. EDL-14, pp. 32-43, 1992.
 
5
U. Choudhury and A. Sangiovanni-Vincentelli, "Automatic Generation of Analytical Models for Interconnect Capacitances," IEEE Trans. on Computer-Aided Design, vol. 14, no. 4, April, 1995, pp. 470-480.
 
6
J. Cong, L. He, A. B. Kahng, D. Noice, N. Shirali and S. H.-C. Yen, "Analysis and Justification of a Simple, Practical 2 1/2-D Capacitance Extraction Methodology", UCLA Computer Science Dept. Tech. Report CSD-970013, 1997 (available at http://b allade.cs.ucla.edu/-helei / public at ions. ht ml ).
 
7
R. Guerrieri and A. Sangiovanni-Vincentelli, "Three-Dimensional Capacitance Evaluation on a Connection Machine," IEEE Trans. on Computer-Aided Design, vol. 7, pp. 1125-1133, 1988.
 
8
K. Nabors and J. White, "Fastcap: A Multipole Accelerated 3-D Capacitance Extraction Program," IEEE Trans. on Computer-Aided Design, vol. 10, no. 11, Nov. 1991, pp. 1447-1459.
 
9
Z. Ning and P. M. Dewilde, "SPIDER - Capacitance Modeling for VLSI Interconnections," IEEE Trans. on Computer-Aided Design, vol. 7, no. 12, pp. 1221-1228, Dec. 1988.
 
10
T. Sakurai, "Closed-Form Expressions for Interconnect Delay, Coupling, Crosstalk in VLSI's," IEEE Trans. on Electron Devices, vol. ED-40, pp. 118-124, 1993.
 
11
A. Seidl, A. Svoboda, J. Oberndorfer, and W. Rosner, "CAPCAL - A 3D Capacitance Solver for Support of CAD Systems," IEEE Trans. on Computer-Aided Design, vol. 7, no. 11, 1988, pp. 549- 556.
 
12
S. Yen and N. Shirali, "Capacitance Extraction", Cadence Design Systems Application Note, 1995.
 
13
Semiconductor Industry Association, National Technology Roadmap for Semiconductors, 1994.

CITED BY  13

Collaborative Colleagues:
Jason Cong: colleagues
Lei He: colleagues
Andrew B. Kahng: colleagues
David Noice: colleagues
Nagesh Shirali: colleagues
Steve H.-C. Yen: colleagues