| Hierarchical 2-D field solution for capacitance extraction for VLSI interconnect modeling |
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Annual ACM IEEE Design Automation Conference
archive
Proceedings of the 34th annual Design Automation Conference
table of contents
Anaheim, California, United States
Pages: 127 - 132
Year of Publication: 1997
ISBN:0-89791-920-3
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Authors
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E. Aykut Dengi
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Motorola Inc., 3501 Ed Bluestein Blvd., Austin, TX
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Ronald A. Rohrer
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Dept. of ECE, Carnegie Mellon University, 5000 Forbes Ave., Pittsburgh, PA
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Downloads (6 Weeks): 4, Downloads (12 Months): 23, Citation Count: 2
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ABSTRACT
A hierarchical two-dimensional field solution technique isintroduced for capacitance extraction for VLSI interconnectmodeling. As a basis for compromise between the efficiencyof Boolean rules-based extraction and the accuracy of flatfield solution, this hierarchical approach can handlerealistic conductor cross-sections and multiple conformaland/or planarized dielectrics.
REFERENCES
Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.
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