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Hierarchical 2-D field solution for capacitance extraction for VLSI interconnect modeling
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Source Annual ACM IEEE Design Automation Conference archive
Proceedings of the 34th annual Design Automation Conference table of contents
Anaheim, California, United States
Pages: 127 - 132  
Year of Publication: 1997
ISBN:0-89791-920-3
Authors
E. Aykut Dengi  Motorola Inc., 3501 Ed Bluestein Blvd., Austin, TX
Ronald A. Rohrer  Dept. of ECE, Carnegie Mellon University, 5000 Forbes Ave., Pittsburgh, PA
Sponsors
EDAC : Electronic Design Automation Consortium
IEEE-CAS : Circuits & Systems
SIGDA: ACM Special Interest Group on Design Automation
Publisher
ACM  New York, NY, USA
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Downloads (6 Weeks): 4,   Downloads (12 Months): 23,   Citation Count: 2
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ABSTRACT

A hierarchical two-dimensional field solution technique isintroduced for capacitance extraction for VLSI interconnectmodeling. As a basis for compromise between the efficiencyof Boolean rules-based extraction and the accuracy of flatfield solution, this hierarchical approach can handlerealistic conductor cross-sections and multiple conformaland/or planarized dielectrics.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
1
The National Technology Roadmap for Semiconductors, Semiconductor Industry Association, 4300 Stevens Creek Blvd, Suite 271, San Jose, CA 95129, 1994
 
2
Wright, EJ.; Shih, Y.-C.A., "Capacitance of top leads metal - comparison between formula, simulation, and experiment," IEEE Trans. Comput.-Aided Des. Integ1: Circuits Syst. (USA); vo1.12, no.12; Dec. 1993; pp. 1897-902
 
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Gustavson, F.; Liniger, W.; Willoughby, R. "Symbolic generation of an optimal Crout algorithm for sparse systems of linear equations," IBM Corporation. Yorktown Heights, N.Y., Res. Paper RC 1852, June 1967
 
6
Raphael Interconnect Analysis User's Manual, Technology Modeling Associates, Inc. Third Floor, 300 Hamilton Ave., Palo Alto, CA 94301, Aug. 1993
 
7
Dengi, E.A.; Rohrer, R.A., "Hierarchical 2-D Field Solution for Capacitance Extraction for VLSI Interconnect Modeling," SRC Technical Report #CMUCAD-96-32, July 1996
 
8
Dengi, E. A., "A Parasitic Capacitance Extraction Method for VLSI Circuits," PhD Dissertation, Carnegie Mellon University, March 1997.
 
9
Kumashiro, S.; Rohrer, R.A.; Strojwas, A.J., "Asymptotic waveform evaluation for transient analysis of 3-D interconnect structures," IEEE Trans. Comput.-Aided Des. Integ~: Circuits Syst. (USA), vo1.12, no.7; July 1993 pp.; pp. 988-96 pp.
 
10
Brebbia, C.A., Telles, J.C.E, Wrobel, L.C. Boundary Element Techniques, Springer-Verlag, Berlin, Heidelberg, 1984
 
11
Anand, M.B., et al., "Fully Integrated Back End of the Line Interconnect Process," 1994 VLSI Multilevel Interconnect Conference, June 7-8, 1994, IEEE 1994 pp. 15-21
 
12
Smith, B.; "Domain Decomposition Methods for Partial Differential Equations," the Proceedings of ICASE/LaRC Workshop on Parallel Numerical Algorithms, editors D. E. Keyes, A. Sameh, and V.Venkatakrishnan, Kluwer Publishers, 1995.
 
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14
MATLAB User's Guide, The Mathworks, Inc. Cochituate Place, 24 Prime Park Way, Natick, MA 01760, Aug. 1992


Collaborative Colleagues:
E. Aykut Dengi: colleagues
Ronald A. Rohrer: colleagues