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Laser correcting defects to create transparent routing for large area FPGA's
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Source International Symposium on Field Programmable Gate Arrays archive
Proceedings of the 1997 ACM fifth international symposium on Field-programmable gate arrays table of contents
Monterey, California, United States
Pages 17-23  
Year of Publication: 1997
ISBN:0-89791-801-0
Authors
G. H. Chapman  Simon Fraser University, School of Engineering Science, Burnaby, B.C., Canada V5A 1S6
Benoit Dufort  Simon Fraser University, School of Engineering Science, Burnaby, B.C., Canada V5A 1S6
Sponsor
SIGDA: ACM Special Interest Group on Design Automation
Publisher
ACM  New York, NY, USA
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ABSTRACT

Creating large area FPGA's is limited by the presence of defective sections. The techniques developed in wafer scale work solve this problem by using defect avoidance routing around flawed blocks to build complete working systems. FPGA's have the main features required for successful defect avoidance systems: a repeatable cell, built in need for switchable flexible routing and high flexibility with potentially large number of applications. Laser formed connections and cuts have proved to be effective in bypassing fabrication time defects and creating defect free working systems up to wafer scale in area. Power shorts and clock distribution errors can effectively be eliminated using these laser links. In addition it is important to minimize signal delays so the bypassing of the defective cells is nearly invisible. Experiments on a small test FPGA shows defect avoidance routing using laser link structures generates delays which are about half those obtained by the active switches required for the FPGA's operation. Thus laser defect avoidance after fabrication removes the errors creating a large area FPGA whose defective cell distribution is nearly unseen by the user.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
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J.I. Raffel, A.H. Anderson, and G.H. Chapman, "Laser Restructurable Technology and Design", Chapter 7, pg 319-363 in "Wafer Scale Integration", E. Swartzlander, ed., Kluwer Academic, 1988.
 
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J.M. Canter, G.H. Chapman, B. Mathur, M.L. Naiman, and J.I. Raffel, "A Laser-Induced Ohmic link for Wafer Scale Integration in Standard CMOS Processing", 44th Annual Device Research Conference, paper VB-6, IEEE Trans. Elec. Dev., ED-33, 11, 1861 (1986).
 
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Benoit Dufort, "Test Vehicle for a Wafer Scale Field Programmable Gate Array", MSc thesis, School of Eng. Science, Simon Fraser Univ., Bumaby, BC. (1995)
 
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Technolgoical Review, 12, July 1995


Collaborative Colleagues:
G. H. Chapman: colleagues
Benoit Dufort: colleagues