| Efficient reduced-order modeling for the transient simulation of three-dimensional interconnect |
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International Conference on Computer Aided Design
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Proceedings of the 1995 IEEE/ACM international conference on Computer-aided design
table of contents
San Jose, California, United States
Pages: 40 - 44
Year of Publication: 1995
ISBN:0-8186-7213-7
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Authors
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Mike Chou
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Department of EECS, Massachusetts Institute of Technology, Cambridge, MA
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Jacob White
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Department of EECS, Massachusetts Institute of Technology, Cambridge, MA
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IEEE Computer Society
Washington, DC, USA
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| Bibliometrics |
Downloads (6 Weeks): 4, Downloads (12 Months): 7, Citation Count: 1
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ABSTRACT
Abstract: Multipole-accelerated surface-volume methods have proved to be very efficient techniques for delay and cross-talk simulation of three-dimensional integrated circuit interconnect. However, to be efficiently combined with transistor circuitry in a SPICE-level simulation, reduced-order models which have accurate low-frequency behavior must be constructed. Asymptotic Waveform Evaluation (AWE) or Pade-via-Lanczos (PVL) algorithms can not be used directly to construct the reduced-order models from the surface-volume formulation, because the formulation generates dense matrices which are too expensive to factor. In this paper we describe a two-level approach to efficiently generating reduced-order models with accurate low frequency behavior. First, reduced-order models which match Taylor series terms at s=/spl infin/ are efficiently generated from the surface-volume formulation using an Arnoldi method, and then these fairly high-order models are used to efficiently construct lower-order models which snatch Taylor series terms at s=0. Examples are given to demonstrate the accuracy of the resultant low-order model.
REFERENCES
Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.
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S. Kumashiro, R. Rohrer, and A. Strojwas. A new efficient method for the transient simulation of three-dimensional interconnect structures. In Proc. Int. Electron Devices Meeting, December 1990.
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Mike Chou , Tom Korsmeyer , Jacob White, Transient simulations of three-dimensional integrated circuit interconnect using a mixed surface-volume approach, Proceedings of the 32nd ACM/IEEE conference on Design automation, p.485-490, June 12-16, 1995, San Francisco, California, United States
[doi> 10.1145/217474.217575]
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Lawrence T. Pillage and Ronald A. Rohrer. Asymptotic Waveform Evaluation for Timing Analysis. IEEE Trans. CAD, 9(4):352-366, April 1990.
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Albert E. Ruehli. Equivalent Circuit Models for Three-Dimensional Multiconductor Systems. IEEE Transactions on Microwave Theory and Techniques, MTT-22(3):216-221, March 1974.
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H. Haus and J. Melcher. Electromagnetic Fields and Energy. Prentice Hall, Englewood Cliffs, N.J., 1989.
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L. Miguel Silveira , Mattan Kamon , Jacob White, Efficient reduced-order modeling of frequency-dependent coupling inductances associated with 3-D interconnect structures, Proceedings of the 32nd ACM/IEEE conference on Design automation, p.376-380, June 12-16, 1995, San Francisco, California, United States
[doi> 10.1145/217474.217558]
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INDEX TERMS
Primary Classification:
B.
Hardware
B.7
INTEGRATED CIRCUITS
B.7.2
Design Aids
Subjects:
Simulation
General Terms:
Algorithms,
Theory
Keywords:
Arnoldi method,
SPICE-level simulation,
Taylor series terms,
circuit analysis computing,
integrated circuit interconnect,
integrated circuit interconnections,
reduced-order modeling,
reduced-order models,
series (mathematics),
surface-volume methods,
three-dimensional interconnect,
transient analysis,
transient simulation
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