Designing interconnection networks for multi-level packaging

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Designing interconnection networks for multi-level packaging

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Conference on High Performance Networking and Computing archive
Proceedings of the 1993 ACM/IEEE conference on Supercomputing table of contents

Portland, Oregon, United States

Pages: 772 - 781

Year of Publication: 1993

ISBN:0-8186-4340-4

Authors

M. T. Raghunath	Computer Science Division, University of California, Berkeley, CA
A. Ranade	Computer Science Division, University of California, Berkeley, CA

Sponsor

SIGARCH: ACM Special Interest Group on Computer Architecture

Publisher

ACM New York, NY, USA

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Downloads (6 Weeks): 0, Downloads (12 Months): 3, Citation Count: 1

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REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

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