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Automated failure population creation for validating integrated circuit diagnosis methods
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Source Annual ACM IEEE Design Automation Conference archive
Proceedings of the 46th Annual Design Automation Conference table of contents
San Francisco, California
SESSION: Targeted test and diagnosis table of contents
Pages 708-713  
Year of Publication: 2009
ISBN:978-1-60558-497-3
Authors
Wing Chiu Tam  Carnegie Mellon University, Pittsburgh, PA
Osei Poku  Carnegie Mellon University, Pittsburgh, PA
R. D. (Shawn) Blanton  Carnegie Mellon University, Pittsburgh, PA
Sponsors
EDAC : Electronic Design Automation Consortium
SIGDA: ACM Special Interest Group on Design Automation
IEEE-CAS : Circuits & Systems
Publisher
ACM  New York, NY, USA
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ABSTRACT

Integrated circuit (IC) diagnosis typically analyzes failed chips by reasoning about their responses to test patterns to deduce what has gone wrong. Current trends use diagnosis as the first step in extracting valuable information from a large population of failing ICs that include, for example, design-feature failure rates and defect-occurrence statistics. However, it is difficult to examine the accuracy of these techniques because of the unavailability of sufficient fail data where such information is known. This paper describes an approach for benchmarking and verifying diagnosis techniques through failure population creation that builds on prior work in this area. Specifically, we describe how a population of realistic IC failures is created through circuit-level simulation of extracted layouts. The most novel feature of the work is that the virtual test responses produced are both a precise function of defect type and the three-dimensional location within the layout. The extended approach is demonstrated using twelve placed-and-routed circuits. An example application of the developed framework is given to illustrate the utility of having a failure population where the location and type of defect are known a priori.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
1
M. Keim, et al., "A Rapid Yield Learning Flow Based on Production Integrated Layout-Aware Diagnosis," International Test Conference, p. 7.1, Oct. 2006.
 
2
H. Tang, et al., "Analyzing Volume Diagnosis Results with Statistical Learning for Yield Improvement," European Test Symposium, pp. 145--150, May 2007.
 
3
J. E. Nelson, W. Maly and R. D. Blanton, "Diagnosis-Enhanced Extraction of Defect Density and Size Distributions from Digital Logic ICs," Techcon 2007.
 
4
X. Yu, et al., "Controlling DPPM through Volume Diagnosis," VLSI Test Symposium, pp. 134--139, May 2009.
 
5
S. D. Millman, E. J. McCluskey and J. M. Acken, "Diagnosing CMOS Bridging Faults with Stuck-At Fault Dictionaries," Inlemafional Test Conference, pp. 860--870, Oct. 1990.
 
6
S. Venkataraman and S. B. Drummonds, "POIROT A Logic Fault Diagnosis Tool and Its Applications," International Test Conference, pp. 253--262, Oct. 2000.
 
7
S. B. Drummonds et al., "Bridging the Gap Between Logical Diagnosis and Physical Analysis," IEEE International Workshop on Defect Based Testing, April 2002.
 
8
Y. Sato et al., "A Persistent Diagnostic Technique for Unstable Defects," International Test Conference, pp. 242--249, Oct. 2002.
 
9
T. Bartenstein et al., "Diagnosing combinational Logic Designs Using the Single Location At-a-Time (SLAT) Paradigm," International Test Conference, pp. 287--296, Oct. 2001.
 
10
D. B. Lavo, I. Hartanto and T. Larrabee, "Multiplets, Models, and the Search for Meaning: Improving Per-Test Fault Diagnosis," International Test Conference, pp. 250--259, Oct. 2002.
 
11
M. Sharma et al., "Faster Defect Localization in Nanometer Technology Based on Defective Cell Diagnosis," International Test Conference, p. 15.3, Oct. 2007.
 
12
M. Sharma et al., "Efficiently Performing Yield Enhancements by Identifying Dominant Physical Root Cause from Test Fail Data," International Test Conference, p. 14.3, Oct. 2008.
 
13
B. Engel et al., "The Art of Cross Sectioning," Microelectronics Failure Analysis Desktop Reference, p. 473, 2004.
 
14
T. Vogels et al., "Benchmarking Diagnosis Algorithms With a Diverse Set of IC Deformations," International Test Conference, pp. 250--259, pp. 508--517, Oct. 2004.
 
15
The Star-HSPICE Reference Manual, Synopsys, Mountain View, CA, www.synopsys.com.
 
16
Extensible Markup Language (XML) 1.0, http://www.w3.org/XML/.
 
17
C. Hora and S. Eichenberger, "Towards High Accuracy Fault Diagnosis of Digital Circuits," International Symposium for Testing and Failure Analysis, pp. 47--51, 2004.
 
18
W. C. Tam, O. Poku, and R. D. Blanton, "Precise Failure Localization Using Automated Layout Analysis of Diagnosis Candidates," Design Automation Conference, pp. 367--372, June 2008.
 
19
J. P. Shen, W. Maly, and F. J. Ferguson, "Inductive Fault Analysis of MOS Integrated Circuits," IEEE Design and Test of Computers, Dec. 1985.
 
20
A. L. Jee and F. J. Ferguson, "CARAFE: An Inductive Fault Analysis Tool for CMOS VLSI Circuits," VLSI Test Symposium, pp. 92--98, April 1993.
 
21
F. Brglez and H. Fujiwara, "A Neutral Netlist of 10 Combinational Benchmark Circuits and a Target Translator in Fortran," Int. Symp. on Circuits and Systems, 1985.
 
22
F. Brglez, D. Bryan and K. Kozminski, "Combinational profiles of sequential benchmark circuits," Int. Symp. on Circuits and Systems, pp. 1929--1934, 1989.
 
23
R. Desineni, O. Poku, and R. D. Blanton, "A Logic Diagnosis Methodology for Improved Localization and Extraction of Accurate Defect Behavior," International Test Conference, p. 12.3, Oct. 2006.
 
24
The SKILL Language Reference Manual, Cadence Design Systems, Inc., San Jose, CA, www.cadence.com.
 
25
The Graphic Data System (GDS) II Format, Cadence Design Systems, Inc., San Jose, CA, www.cadence.com.
 
26
The Diva Reference Manual, Cadence Design Systems, Inc., San Jose, CA, www.cadence.com.
 
27
B. Kruseman et al., "Systematic Defects in Deep-Submicron Technologies," International Test Conference, pp. 290--299, Oct. 2004.
 
28
R. D. Blanton et al., "Fault Tuples in Diagnosis of Deep-Submicron Circuits," International Test Conference, pp. 233--241, Oct 2002.
 
29
The Cadence Encounter Reference Manual, Cadence Design Systems, Inc., San Jose, CA, www.cadence.com.
 
30
The MOSIS Service, Marina del Rey, CA, www.mosis.com.
 
31
H. K. Lee and D. S. Ha, "Atalanta: An Efficient ATPG for Combinational Circuits," Technical Report, 93--12, Dept of Electrical Engineering, Virginia Polytechnic Institute and State University, Blacksburg, Virginia, 1993.
 
32
R. Rodriguez-Montanes et al., "Diagnosis of Full Open Defects in Interconnecting Lines," VLSI Test Symposium, pp. 158--166, May 2007.
 
33
R. D. Blanton, K. N. Dwarakanath, and R. Desineni, "Defect Modeling Using Fault Tuples," IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, pp. 2450--2464, Nov. 2006.