| Thermal-aware data flow analysis |
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Annual ACM IEEE Design Automation Conference
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Proceedings of the 46th Annual Design Automation Conference
table of contents
San Francisco, California
SESSION: WACI: wild and crazy ideas
table of contents
Pages 613-614
Year of Publication: 2009
ISBN:978-1-60558-497-3
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Downloads (6 Weeks): 18, Downloads (12 Months): 18, Citation Count: 0
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ABSTRACT
This paper suggests that the thermal state of a processor can be approximated using data flow analysis. The results of this analysis can be used to evaluate the efficacy of thermal-aware compilation strategies, or as input to thermal-aware optimizations that occur in the early stages of back-end compilation. We propose different ways how the exploitation of thermal behavior knowledge can be included in the different compilation phases.
REFERENCES
Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.
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