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Thermal-aware data flow analysis
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Source Annual ACM IEEE Design Automation Conference archive
Proceedings of the 46th Annual Design Automation Conference table of contents
San Francisco, California
SESSION: WACI: wild and crazy ideas table of contents
Pages 613-614  
Year of Publication: 2009
ISBN:978-1-60558-497-3
Authors
José L. Ayala  Complutense University of Madrid, Madrid, Spain
David Atienza  ESL and LAP, EPFL, Lausanne, Switzerland
Philip Brisk  ESL and LAP, EPFL, Lausanne, Switzerland
Sponsors
EDAC : Electronic Design Automation Consortium
SIGDA: ACM Special Interest Group on Design Automation
IEEE-CAS : Circuits & Systems
Publisher
ACM  New York, NY, USA
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ABSTRACT

This paper suggests that the thermal state of a processor can be approximated using data flow analysis. The results of this analysis can be used to evaluate the efficacy of thermal-aware compilation strategies, or as input to thermal-aware optimizations that occur in the early stages of back-end compilation. We propose different ways how the exploitation of thermal behavior knowledge can be included in the different compilation phases.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
1
Srinivasan, J., et al. Predictive dynamic thermal management for multimedia applications. In Proc. 17th ICS, pp. 109--120, 2003.
 
2
Atienza, D., et al. Reliability-aware design for nanometer-scale devices. In Proc. ASPDAC, pp. 549--554, 2008.
 
3
Zhou, X., et al. Compiler-driven register re-assignment for register file power-density and temperature reduction. In Proc. DAC, pp. 750--753, 2008.
 
4
Schafer, B. C., et al. Temperature-Aware Compilation for VLIW Processors. In Proc. RTCSA, pp. 426--431, 2007.
 
5
Atienza, D., et al. HW-SW emulation framework for temperature-aware design in MPSoCs. ACM TODAES, 12(3), pp. 1--26, August, 2007.
 
6
Cooper, K. D., and Torczon, L. Engineering a Compiler, Morgan-Kaufmann, San Francisco, CA, USA, 2003.
 
7
Stephenson, M., et al. Bitwidth analysis with application to silicon compilation, In Proc. of PLDI, pp. 108--120, 2000.