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Spectrum: a hybrid nanophotonic-electric on-chip network
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Source Annual ACM IEEE Design Automation Conference archive
Proceedings of the 46th Annual Design Automation Conference table of contents
San Francisco, California
SESSION: Future interconnect technologies: how do on-chip networks evolve? table of contents
Pages 575-580  
Year of Publication: 2009
ISBN:978-1-60558-497-3
Authors
Zheng Li  Tsinghua University, Beijing, China
Dan Fay  University of Colorado, Boulder, CO
Alan Mickelson  University of Colorado, Boulder, CO
Li Shang  University of Colorado, Boulder, CO
Manish Vachharajani  University of Colorado, Boulder, CO
Dejan Filipovic  University of Colorado, Boulder, CO
Wounjhang Park  University of Colorado, Boulder, CO
Yihe Sun  Tsinghua University, Beijing, China
Sponsors
EDAC : Electronic Design Automation Consortium
SIGDA: ACM Special Interest Group on Design Automation
IEEE-CAS : Circuits & Systems
Publisher
ACM  New York, NY, USA
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ABSTRACT

On many-core chip designs, short, often-multicast, latency-critical messages, used extensively in high-level coherence and synchronization protocols, often become the bottleneck of parallel performance scaling. This paper presents Spectrum, a hybrid nanophotonic-electric on-chip network that optimizes both throughput and latency. Spectrum's novel planar nanophotonic subnetwork broadcasts latency-critical messages through a wavelength-division multiplexed (WDM) two-dimensional waveguide. Spectrum's throughput-optimized packet-switching electrical subnetwork handles high bandwidth traffic. Overall, Spectrum delivers an almost ideal CMOS-compatible interconnection network for many-core systems.


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