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Guess, solder, measure, repeat: how do I get my mixed-signal chip right?
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Source Annual ACM IEEE Design Automation Conference archive
Proceedings of the 46th Annual Design Automation Conference table of contents
San Francisco, California
PANEL SESSION: Panel table of contents
Pages 520-521  
Year of Publication: 2009
ISBN:978-1-60558-497-3
Authors
Geoffrey Ying  Synopsys Inc., Mountain View, CA
Andreas Kuehlmann  Cadence Design Systems, San Jose, CA
Ken Kundert  Designer's Guide Consulting, Los Altos, CA
George Gielen  Katholieke Universiteit Leuven, Leuven, Belgium
Eric Grimme  Intel Corp., Hillsboro, OR
Martin O'Leary  Cadence Design Systems, San Jose, CA
Sandeep Tare  Texas Instruments, Dallas, TX
Warren Wong  Synopsys Inc., Maintain View, CA
Sponsors
EDAC : Electronic Design Automation Consortium
SIGDA: ACM Special Interest Group on Design Automation
IEEE-CAS : Circuits & Systems
Publisher
ACM  New York, NY, USA
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ABSTRACT

Over the past 20 years, EDA has developed a solid digital implementation methodology that combines some restrictions on the design style with a set of comprehensive tools leading to predictable design flows. The recent increased use of analog components in complex SOC designs triggered a set of verification challenges ranging from simple connectivity problems to complex interferences between analog and digital data blocks. This panel discusses the state of the affairs in analog-mixed signal verification and draws a picture of future directions in terms of new approaches and tools.