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DFM: don't care or competitive weapon?
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Source Annual ACM IEEE Design Automation Conference archive
Proceedings of the 46th Annual Design Automation Conference table of contents
San Francisco, California
PANEL SESSION: Panel table of contents
Pages 296-297  
Year of Publication: 2009
ISBN:978-1-60558-497-3
Authors
Mark Redford  Cambridge Silicon Radio, Cambridge, U.K.
Joseph Sawicki  Mentor Graphics, Wilsonville, OR
Prasad Subramaniam  eSilicon, Murray Hill, N.J.
Cliff Hou  TSMC, Hsinchu, Taiwan
Yervant Zorian  Virage Logic, Fremont, CA
Kimon Michaels  PDF Solutions, San Jose, CA
Sponsors
EDAC : Electronic Design Automation Consortium
SIGDA: ACM Special Interest Group on Design Automation
IEEE-CAS : Circuits & Systems
Publisher
ACM  New York, NY, USA
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ABSTRACT

The external specifications of an IC (functions, clock rate, power consumption, etc.) determine the competitiveness of a product. To be successful and profitable in the IC business, designers need to "out-design" their competitors. Usually, Design-For-Manufacturing (DFM) is discussed as a yield improvement strategy, but what is the value of DFM from a competitive point of view? Can DFM gives designers a competitive lever by helping them decide how far to push a design without creating a manufacturing disaster? Can DFM be used to optimize designs rather than just identify hot spots?

This panel will explore these and other questions such as:

• Signoff as a business decision---avoiding disaster while gaining competitive advantage

• Rules vs. modeling...style or substance?

• Do RDRs help or hinder competitive advantage?

• Can DFM help ensure a parametric yield envelop this is competitive?

• Design-to-Fab flow as a total quality management process