| Efficient smart sampling based full-chip leakage analysis for intra-die variation considering state dependence |
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Annual ACM IEEE Design Automation Conference
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Proceedings of the 46th Annual Design Automation Conference
table of contents
San Francisco, California
SESSION: Low-power design and analysis techniques
table of contents
Pages: 154-159
Year of Publication: 2009
ISBN:978-1-60558-497-3
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Authors
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Vineeth Veetil
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University of Michigan, Ann Arbor, MI
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Dennis Sylvester
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University of Michigan, Ann Arbor, MI
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David Blaauw
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University of Michigan, Ann Arbor, MI
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Saumil Shah
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Blaze DFM, Sunnyvale, CA
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Steffen Rochel
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Blaze DFM, Sunnyvale, CA
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Downloads (6 Weeks): 13, Downloads (12 Months): 36, Citation Count: 0
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ABSTRACT
Leakage power minimization is critical to semiconductor design in nanoscale CMOS. On the other hand increasing variability with scaling adds complexity to the leakage analysis problem. In this work we seek to achieve tractability in Monte Carlo-based statistical leakage analysis. A novel approach for fast and accurate statistical leakage analysis considering inter-die and intra-die components is proposed. We show that the optimal way to select samples, to capture intra-die variation accurately, is according to the probability distribution function of total process variation. Intelligent selection of samples is performed using a Quasi Monte Carlo technique. Results are presented for benchmarks with sizes varying from approximately 5,000 to 200,000 gates. The largest benchmark with 198461 gates is evaluated in 3 minutes with the proposed approach compared to 23 hours for random sampling with comparable accuracy. Compared to a conventional analytical approach using Wilkinson's approximation, the proposed technique offers superior accuracy while maintaining efficiency. State dependence and multiple sources of variation are considered and the approach is scalable with number of process parameter variables for standard cell characterization cost. We also show reduction in sample size to meet target accuracy for computing leakage distribution due to the inter-die component only when compared to random selection of samples.
REFERENCES
Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.
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Tao Li , Wenjun Zhang , Zhiping Yu, Full-chip leakage analysis in nano-scale technologies: mechanisms, variation sources, and verification, Proceedings of the 45th annual Design Automation Conference, June 08-13, 2008, Anaheim, California
[doi> 10.1145/1391469.1391622]
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I. M. Sobol, "The Distribution of Points in a Cube and the Approximate Evaluation of Integrals", USSR Comp. Math and Math. Phys., 7(4), pp. 86--112, 1967.
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A. Papoulis, Probability, Random Variables and Stochastic Processes, McGraw-Hill Inc., New York 1991.
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Rajeev R. Rao , Anirudh Devgan , David Blaauw , Dennis Sylvester, Parametric yield estimation considering leakage variability, Proceedings of the 41st annual Design Automation Conference, June 07-11, 2004, San Diego, CA, USA
[doi> 10.1145/996566.996693]
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