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Improving STT MRAM storage density through smaller-than-worst-case transistor sizing
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Source Annual ACM IEEE Design Automation Conference archive
Proceedings of the 46th Annual Design Automation Conference table of contents
San Francisco, California
SESSION: Design and optimization of nanocircuits table of contents
Pages 87-90  
Year of Publication: 2009
ISBN:978-1-60558-497-3
Authors
Wei Xu  Rensselaer Polytechnic Institute, Troy, NY
Yiran Chen  Seagate Technology, Bloomington, MN
Xiaobin Wang  Seagate Technology, Bloomington, MN
Tong Zhang  Rensselaer Polytechnic Institute, Troy, NY
Sponsors
EDAC : Electronic Design Automation Consortium
SIGDA: ACM Special Interest Group on Design Automation
IEEE-CAS : Circuits & Systems
Publisher
ACM  New York, NY, USA
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ABSTRACT

This paper presents a technique to improve the storage density of spin-torque transfer (STT) magnetoresistive random access memory (MRAM) in the presence of significant magnetic tunneling junction (MTJ) write current threshold variability. In conventional design practice, the nMOS transistor within each memory cell is sized to be large enough to carry a current larger than the worst-case MTJ write current threshold, leading to an increasing storage density penalty as the technology scales down. To mitigate such variability-induced storage density penalty, this paper presents a smaller-than-worst-case transistor sizing approach with the underlying theme of jointly considering memory cell transistor sizing and defect tolerance. Its effectiveness is demonstrated using 256Mb STT MRAM design at 45nm node as a test vehicle. Results show that, under a normalized write current threshold deviation of 20%, the overall memory die size can be reduced by more than 20% compared with the conventional worst-case transistor sizing design practice.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
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