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A scalable micro wireless interconnect structure for CMPs
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International Conference on Mobile Computing and Networking archive
Proceedings of the 15th annual international conference on Mobile computing and networking table of contents
Beijing, China
SESSION: Wireless networks potpourri table of contents
Pages 217-228  
Year of Publication: 2009
ISBN:978-1-60558-702-8
Authors
Suk-Bok Lee  UCLA, Los Angeles, CA, USA
Sai-Wang Tam  UCLA, Los Angeles, CA, USA
Ioannis Pefkianakis  UCLA, Los Angeles, CA, USA
Songwu Lu  UCLA, Los Angeles, CA, USA
M. Frank Chang  UCLA, Los Angeles, CA, USA
Chuanxiong Guo  Microsoft Research Asia, Beijing, China
Glenn Reinman  UCLA, Los Angeles, CA, USA
Chunyi Peng  Microsoft Research Asia, Beijing, China
Mishali Naik  UCLA, Los Angeles, CA, USA
Lixia Zhang  UCLA, Los Angeles, CA, USA
Jason Cong  UCLA, Los Angeles, CA, USA
Sponsors
SIGMOBILE: ACM Special Interest Group on Mobility of Systems, Users, Data and Computing
ACM: Association for Computing Machinery
Publisher
ACM  New York, NY, USA
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ABSTRACT

This paper describes an unconventional way to apply wireless networking in emerging technologies. It makes the case for using a two-tier hybrid wireless/wired architecture to interconnect hundreds to thousands of cores in chip multiprocessors (CMPs), where current interconnect technologies face severe scaling limitations in excessive latency, long wiring, and complex layout. We propose a recursive wireless interconnect structure called the WCube that features a single transmit antenna and multiple receive antennas at each micro wireless router and offers scalable performance in terms of latency and connectivity. We show the feasibility to build miniature on-chip antennas, and simple transmitters and receivers that operate at 100-500 GHz sub-terahertz frequency bands. We also devise new two-tier wormhole based routing algorithms that are deadlock free and ensure a minimum-latency route on a 1000-core on-chip interconnect network. Our simulations show that our protocol suite can reduce the observed latency by 20% to 45%, and consumes power that is comparable to or less than current 2-D wired mesh designs.


REFERENCES

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