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Multichannel intracortical neurorecording: integration and packaging challenges
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Proceedings of the 22nd Annual Symposium on Integrated Circuits and System Design: Chip on the Dunes table of contents
Natal, Brazil
SESSION: Invited talks table of contents
Article No.: 4  
Year of Publication: 2009
ISBN:978-1-60558-705-9
Authors
Mohamad Sawan  Ecole Polytechnique de Montreal
Benoit Gosselin  Ecole Polytechnique de Montreal
Sponsors
: IEEE Circuits & Systems Society
SBMICRO : Brazilian Microelectronics Society
SBC : Brazilian Computer Society
SIGDA: ACM Special Interest Group on Design Automation
Publisher
ACM  New York, NY, USA
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ABSTRACT

This paper covers an overview of multichannel massively parallel biosensing device dedicated for neural recording from the cortex. Attention is paid to describe the design techniques and assembly methods of high reliability Microsystems. These devices are optimized, first from the circuit level, to meet ultra low-power budget and all needed flexibility for efficient neurorecording. Second, at the system level, integration of multichips and their interconnections on top of electrode arrays represent challenging tasks to optimize the building of implantable intracortical sensors. Such device includes electrode arrays, preamplification front-end, data conversion, signal processing for the detection of neural events (spikes). It includes also multiple wireless links, the first one is for affording the energy to power up the whole implant, while data are exchanged bidirectionaly with a base station through two other links for data down and up links. Experimental results are shown.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
1
M. Sawan, Y. Hu, J. Coulombe, "Wireless Smart Implants Dedicated to Multichannel Monitoring and Microstimulation", Invited paper in IEEE Circuits and Systems Magazine, Vol. 5, 2005, pp. 21--39.
 
2
R. R. Harrison, P. T. Watkins, R. J. Kier, R. O. Lovejoy, D. J. Black, B. Greger, and F. Solzbacher, "A low-power integrated circuit for a wireless 100-electrode neural recording system," Solid-State Circuits, IEEE Journal of, vol. 42, no. 1, pp. 123--133, Jan. 2007.
 
3
B. Gosselin, A. E. Ayoub, J. F. Roy, M. Sawan, F. Lepore, A. Chaudhuri, and D. Guitton, "A Mixed-Signal Multichip Neural Recording Interface With Bandwidth Reduction," IEEE Transactions on Biomedical Circuits and Systems, vol. 3, pp. 129--141, 2009.
 
4
D. K. Nguyen and S. S. Spencer, "Invasive EEG in Presurgical Evaluation of Epilepsy," in The Treatment of Epilepsy (2nd Edition), S. D. Shorvon and D. R. Fish, Eds., 2007, pp. 609--634.
 
5
R. H. Olsson, and K. D. Wise, "A three-dimensional neural recording microsystem with implantable data compression circuitry," IEEE Journal of Solid-State Circuits, vol. 40, pp. 2796--2804, 2005.
 
6
Y. Perelman and R. Ginosar, "An Integrated System for Multichannel Neuronal Recording With Spike/LFP Separation, Integrated A/D Conversion and Threshold Detection," IEEE Transactions on Biomedical Engineering, vol. 54, pp. 130--137, 2007.
 
7
A. M. Sodagar, K. D. Wise, and K. Najafi, "A Fully Integrated Mixed-Signal Neural Processor for Implantable Multichannel Cortical Recording," IEEE Transactions on Biomedical Engineering, vol. 54, pp. 1075--1088, 2007.
 
8
G. Simard, M. Sawan, D. Massicotte, "Novel Coils Geometry Intended for Biomedical Implants with Multiple Carrier Inductive Link", IEEEISCAS, Taipei, Taiwan, May 2009.
 
9
B. Gosselin, M. Sawan, A. Chapman, "A Low-Power Integrated Bioamplifier With a New DC Rejection Scheme", IEEE Trans. Biom. Circuits&Systems, Vol. 1, No. 3, 2007, pp. 184--192.
 
10
B. Gosselin and M. Sawan, "An Ultra Low-Power CMOS Automatic Action Potential Detector," IEEE Transactions on Neural Systems and Rehabilitation Engineering, 2009 (In press).
 
11
B. Gosselin, A. Zbrzeski, M. Sawan, and E. Kerhervé, "Low-Power Linear-Phase Delay Filters for Neural Signal Processing: Comparison and Synthesis," in The 2009 IEEE International Symposium on Circuits and Systems (ISCAS) Taipei, Taiwan, 2009.
 
12
A. E. Ayoub, B. Gosselin, and M. Sawan, "A Microsystem Integration Platform Dedicated to Build Multi-Chip-Neural Interfaces," 29th Annual International Conference of the IEEE-EMBS, 2007, pp. 6604--6607.

Collaborative Colleagues:
Mohamad Sawan: colleagues
Benoit Gosselin: colleagues