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High-speed interconnect modeling and high-accuracy simulation using SPICE and finite element methods
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Source Annual ACM IEEE Design Automation Conference archive
Proceedings of the 30th international Design Automation Conference table of contents
Dallas, Texas, United States
Pages: 684 - 690  
Year of Publication: 1993
ISBN:0-89791-577-1
Authors
Sponsors
EDAC : Electronic Design Automation Consortium
IEEE-CAS : Circuits & Systems
SIGDA: ACM Special Interest Group on Design Automation
Publisher
ACM  New York, NY, USA
Bibliometrics
Downloads (6 Weeks): 10,   Downloads (12 Months): 28,   Citation Count: 2
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REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
1
T Sarkar, Z. Maricevic, and M. Karhizi. An accurate de-embedding procedure for characterizing discontinuity. Int. J. Micro- and Milli-meter Wave CAD, 2(3):135, 1992.
 
2
T. Dhaene and D. De Dutter. Selection of lumped element models for coupled lossy transmission lines. 11(7):805, 1992.
 
3
T.Y. Chou and Z.J. Cendes. IC packages capacitance calculation using the finite element method. In Proc. of Elect. Perform. of Elect. Packag. meeting, 76, 1992.
 
4
Z.j. Cendes, D.N. Shenton, and H. Shahnasser. Magnetic field computation using delaunay triangulation and complementary finite element method. IEEE Trans. on Magnetics, 19(6):2551, 1983.
 
5
Z.J. Cendes and D.N. Shenton. Adaptive mesh refinement in the finite element computation of magnetic fields. IEEE Trans. on Magnetics, 21(6):1811, 1985.
 
6
F.Y. Chang. Computer-aided characterization of coupled tern transmission lines. IEEE Trans on Circuit and Systems, 27(12), 1980.
 
7
High Frequency Structure Simulator (HFSS) User's Manual. HP Corporation.
 
8
Microwave Design System (MDS) User's Manual. HP Corporation.


Collaborative Colleagues:
Tai-Yu Chou: colleagues
Jay Cosentino: colleagues
Zoltan J. Cendes: colleagues