ACM Home Page
Please provide us with feedback. Feedback
Hybrid cache architecture with disparate memory technologies
Full text PdfPdf (581 KB)
Source
International Symposium on Computer Architecture archive
Proceedings of the 36th annual international symposium on Computer architecture table of contents
Austin, TX, USA
SESSION: New memory technology table of contents
Pages 34-45  
Year of Publication: 2009
ISBN:978-1-60558-526-0
Also published in ...
Authors
Xiaoxia Wu  Pennsylvania State University, University Park, PA, USA
Jian Li  IBM Austin Research Lab, Austin, TX, USA
Lixin Zhang  IBM Austin Research Lab, Austin, TX, USA
Evan Speight  IBM Austin Research Lab, Austin, TX, USA
Ram Rajamony  IBM Austin Research Lab, Austin, TX, USA
Yuan Xie  Pennsylvania State University, University Park, PA, USA
Sponsors
SIGARCH: ACM Special Interest Group on Computer Architecture
ACM: Association for Computing Machinery
Publisher
ACM  New York, NY, USA
Bibliometrics
Downloads (6 Weeks): 176,   Downloads (12 Months): 449,   Citation Count: 0
Additional Information:

abstract   references   index terms   collaborative colleagues  

Tools and Actions: Request Permissions Request Permissions    Review this Article  
DOI Bookmark: Use this link to bookmark this Article: http://doi.acm.org/10.1145/1555754.1555761
What is a DOI?

ABSTRACT

Caching techniques have been an efficient mechanism for mitigating the effects of the processor-memory speed gap. Traditional multi-level SRAM-based cache hierarchies, especially in the context of chip multiprocessors (CMPs), present many challenges in area requirements, core-to-cache balance, power consumption, and design complexity. New advancements in technology enable caches to be built from other technologies, such as Embedded DRAM (EDRAM), Magnetic RAM (MRAM), and Phase-change RAM (PRAM), in both 2D chips or 3D stacked chips. Caches fabricated in these technologies offer dramatically different power and performance characteristics when compared with SRAM-based caches, particularly in the areas of access latency, cell density, and overall power consumption. In this paper, we propose to take advantage of the best characteristics that each technology offers, through the use of Hybrid Cache Architecture (HCA) designs. We discuss and evaluate two types of hybrid cache architectures: inter cache Level HCA (LHCA), in which the levels in a cache hierarchy can be made of disparate memory technologies; and intra cache level or cache Region based HCA (RHCA), where a single level of cache can be partitioned into multiple regions, each of a different memory technology. We have studied a number of different HCA architectures and explored the potential of hardware support for intra-cache data movement and power consumption management within HCA caches. Utilizing a full-system simulator that has been validated against real hardware, we demonstrate that an LHCA design can provide a geometric mean 7% IPC improvement over a baseline 3-level SRAM cache design under the same area constraint across a collection of 25 workloads. A more aggressive RHCA-based design provides 12% IPC improvement over the baseline. Finally, a 2-layer 3D cache stack (3DHCA) of high density memory technology within the same chip footprint gives 18% IPC improvement over the baseline. Furthermore, up to 70% reduction in power consumption over a baseline SRAM-only design is achieved.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
1
D. A. Bader, Y. Li, T. Li, and V. Sachdeva. BioPerf: A Benchmark Suite to Evaluate High-performance Computer Architecture on Bioinformatics Applications. In Proceedings of the 2005 IEEE International Symposium on Workload Characterization, pages 163--173, 2005.
 
2
D. Bailey, J. Barton, T. Lasinski, and H. Simon. The NAS parallel benchmarks. In Technical report RNR-91-002 revision2, pages 453--464, 1991.
 
3
4
5
 
6
7
 
8
L. Chung. Cell Design Considerations for Phase Change Memory as a Universal Memory. In International Symposium on VLSI Technology, Systems and Applications, pages 132--133, 2008.
 
9
10
 
11
12
 
13
S. Hanzawa, N. Kitai, K. Osada, A. Kotabe, Y. Matsui, N. Matsuzaki, N. Takaura, M. Moniwa, and T. Kawahara. A 512KB Embedded Phase Change Memory with 416kB/s Write Throughput at 100uA Cell Write Current. In IEEE International Solid-State Circuits Conference, pages 474--616, 2007.
 
14
M. Hosomi, H. Yamagishi, T. Yamamoto, and et al. A Novel Nonvolatile Memory with Spin Torque Transfer Magnetization Switching: Spin-RAM. In International Electron Devices Meeting, pages 459--462, 2005.
15
 
16
J. W. Joyner and J. D. Meindl. Opportunities for Reduced Power Dissipation Using Three-dimensional Integration. In Interconnect Technology Conference, pages 148--150, 2002.
17
18
 
19
20
 
21
N. Madan, L. Zhao, N. Muralimanohar, A. Udipi, R. Balasubramonian, R. Iyer, S. Makineni, and D. Newell. Optimizing communication and capacity in a 3D stacked reconfigurable cache hierarchy. In High Performance Computer Architecture, pages 262--274, Feb. 2009.
 
22
R. Morin, A. Kumar, and E. Ilyina. A multi-level comparative performance characterization of specjbb2005 versus specjbb2000. In Proceedings of the IEEE International Workload Characterization, pages 67--75, Oct. 2005.
 
23
 
24
F. Pellizzer, A. Pirovano, F. Ottogalli, M. Magistretti, M. Scaravaggi, P. Zuliani, M. Tosi, A. Benvenuti, P. Besana, S. Cadeo, T. Marangon, R. Morandi, R. Piva, A. Spandre, R. Zonca, A. Modelli, E. Varesi, T. Lowrey, A. Lacaita, G. Casagrande, P. Cappelletti, and R. Bez. Novel utrench Phase-change Memory Cell for Embedded and Stand-alone Non-volatile Memory Applications. In Symposium on VLSI Technology, pages 18--19, 2004.
 
25
 
26
SPEC. Standard Performance Evaluation Corporation. http://www.spec.org/cpu2006/. 2006.
 
27
G. Sun, X. Dong, Y. Xie, J. Li, and Y. Chen. A novel architecture of the 3D stacked MRAM L2 cache for CMPs. In High Performance Computer Architecture, pages 239--249, Feb. 2009.
 
28
X. Wu, J. Li, L. Zhang, E. Speight, and Y. Xie. Power and Performance of Read-Write Aware Hybrid Caches with Non-volatile Memories. In Design, Automation and Test in Europe, 2009.
29
 
30
W. Zhao, E. Belhaire, Q. Mistral, C. Chappert, V. Javerliac, B. Dieny, and E. Nicolle. Macro-model of Spin-Transfer Torque based Magnetic Tunnel Junction device for hybrid Magnetic--CMOS design. In IEEE International Behavioral Modeling and Simulation Workshop, pages 40--43, 2006.

Collaborative Colleagues:
Xiaoxia Wu: colleagues
Jian Li: colleagues
Lixin Zhang: colleagues
Evan Speight: colleagues
Ram Rajamony: colleagues
Yuan Xie: colleagues