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Thermal-aware post compilation for VLIW architectures
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Source
Asia and South Pacific Design Automation Conference archive
Proceedings of the 2009 Asia and South Pacific Design Automation Conference table of contents
Yokohama, Japan
SESSION: Compilation techniques for embedded systems table of contents
Pages 606-611  
Year of Publication: 2009
ISBN:978-1-4244-2748-2
Authors
Wen-Wen Hsieh  National Tsing Hua University, HsinChu, Taiwan, R.O.C
TingTing Hwang  National Tsing Hua University, HsinChu, Taiwan, R.O.C
Sponsors
: IEEE Circuits and Systems Society
SIGDA: ACM Special Interest Group on Design Automation
IEICE ESS : Institute of Electronics, Information and Communication Engineers - Engineering Sciences Society
IPSJ SIGSLDM : Information Processing Society of Japan - SIG System LSI Design Methodology
Publisher
IEEE Press  Piscataway, NJ, USA
Bibliometrics
Downloads (6 Weeks): 7,   Downloads (12 Months): 36,   Citation Count: 0
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ABSTRACT

Development of a thermal management method to reduce hotspots and to balance the temperature distribution has become an important issue. In this paper, we propose a static thermal management technique at compiler level. The target machine is a VLIW architecture where the compiler is required to schedule instructions to achieve instruction level parallelism (ILP). Two technique are proposed. The first one is register binding to balance the temperature of the register file by taking both spatial and temporal thermal information into consideration. The second one is forwarding methods including forwarding-aware architecture and instruction scheduling to reduce the access count of register file. The experimental results show that by combining the two techniques, the peak temperature reduction can reach 7.89 (°C) in the best case and 7.22 (°C) in average with only 0.9% performance penalty in average.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
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K. Sankaranarayanan, S. Velusamy, M. R. Stan, and K. Skadron, "A Case for Thermal-Aware Floorplanning at the Microarchitectural Level," The Journal of Instruction-Level Parallelism Septempter 2005.
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Intel 64 and IA-32 architectures Software Developer's Manual, Intel Corp, "http://www.intel.com/design/processor/manuals"
 
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W. Huangy, K. Sankaranarayanany, R. J. Ribandoz, M. R. Stan and K. Skadron," An Improved Block-Based Thermal Model in HotSpot 4.0 with Granularity Considerations", Proceedings of the Workshop on Duplicating, Deconstructing, and Debunking, June. 2007
 
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S. Rusu, G. Singer, "The First IA-64 Microprocessor", IEEE Journal of Solid-state Circuits, November 2000
Collaborative Colleagues:
Wen-Wen Hsieh: colleagues
TingTing Hwang: colleagues