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Peak temperature control in thermal-aware behavioral synthesis through allocating the number of resources
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Asia and South Pacific Design Automation Conference archive
Proceedings of the 2009 Asia and South Pacific Design Automation Conference table of contents
Yokohama, Japan
SESSION: Advances in behavioral synthesis table of contents
Pages 85-90  
Year of Publication: 2009
ISBN:978-1-4244-2748-2
Authors
Junbo Yu  Tsinghua University, Beijing, China
Qiang Zhou  Tsinghua University, Beijing, China
Jinian Bian  Tsinghua University, Beijing, China
Sponsors
: IEEE Circuits and Systems Society
SIGDA: ACM Special Interest Group on Design Automation
IEICE ESS : Institute of Electronics, Information and Communication Engineers - Engineering Sciences Society
IPSJ SIGSLDM : Information Processing Society of Japan - SIG System LSI Design Methodology
Publisher
IEEE Press  Piscataway, NJ, USA
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ABSTRACT

High temperature adversely impacts on reliability, performance, and leakage power of ICs. In behavioral synthesis, both resource usage allocation and resource binding influence the final thermal profile. Previous thermal-aware behavioral syntheses only focused on binding, ignoring allocation. This paper proposes thermal-aware behavioral synthesis with resource usage allocation. According to power density and feedbacks from thermal simulation, we allocate the number of resources under area constraint. Our flow effectively controls peak temperature and creates even power densities among resources of "different" and "same" types. Compared to classic behavioral synthesis of peak temperature control, our technique reduces peak temperature by 11.1°C on average with no area overhead and only 1.2 more steps latency overhead.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
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L. Shang and R. P. Dick, "Thermal Crisis: Challenges and Potential Solutions," in IEEE Potentials, vol. 25, no. 5, Sep. 2006, pp. 31--35.
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R. Mukherjee, Seda Ogrenci Memik, "An Integrated Approach to Thermal Management in Behavioral Synthesis" IEEE Transactions on Very Large Scale Integration Systems, vol. 14, No. 11, Nov 2006, pp. 1165--1174.
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S. Im and K. Banerjee. Full Chip Thermal Analysis of Planar (2-D) and Vertically Integrated (3-D) High Performance ICs. In IEDM, 2000, pp. 31.4.1--31.4.4.
 
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Collaborative Colleagues:
Junbo Yu: colleagues
Qiang Zhou: colleagues
Jinian Bian: colleagues