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A capacitance solver for incremental variation-aware extraction
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International Conference on Computer Aided Design archive
Proceedings of the 2008 IEEE/ACM International Conference on Computer-Aided Design table of contents
San Jose, California
SESSION: Techniques for next generation interconnect modeling table of contents
Pages 662-669  
Year of Publication: 2008
ISBN ~ ISSN:1092-3152 , 978-1-4244-2820-5
Authors
Tarek A. El-Moselhy  Research Lab in Electronics, Massachusetts Institute of Technology
Ibrahim M. Elfadel  Systems & Technology Group, IBM Corporation
Luca Daniel  Electronics Massachusetts Institute of Technology
Sponsors
: IEEE CASS/CANDE
: IEEE Council on Electronic Design Automation (CEDA)
SIGDA: ACM Special Interest Group on Design Automation
Publisher
IEEE Press  Piscataway, NJ, USA
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ABSTRACT

Lithographic limitations and manufacturing uncertainties are resulting in fabricated shapes on wafer that are topologically equivalent, but geometrically different from the corresponding drawn shapes. While first-order sensitivity information can measure the change in pattern parasitics when the shape variations are small, there is still a need for a high-order algorithm that can extract parasitic variations incrementally in the presence of a large number of simultaneous shape variations. This paper proposes such an algorithm based on the well-known method of floating random walk (FRW). Specifically, we formalize the notion of random path sharing between several conductors undergoing shape perturbations and use it as a basis of a fast capacitance sensitivity extraction algorithm and a fast incremental variational capacitance extraction algorithm. The efficiency of these algorithms is further improved with a novel FRW method for dealing with layered media. Our numerical examples show a 10X speed up with respect to the boundary-element method adjoint or finite-difference sensitivity extraction, and more than 560X speed up with respect to a non-incremental FRW method for a high-order variational extraction.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
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Collaborative Colleagues:
Tarek A. El-Moselhy: colleagues
Ibrahim M. Elfadel: colleagues
Luca Daniel: colleagues