A low-overhead fault tolerance scheme for TSV-based 3D network on chip links

ABSTRACT

Three-dimensional die stacking integration provides the ability to stack multiple layers of processed silicon with a large number of vertical interconnects. Through Silicon Vias (TSVs) provide a promising area- and power-efficient way to support communication between different stack layers. Unfortunately, low TSV yield significantly impacts design of three-dimensional die stacks with a large number of TSVs. This paper presents a defecttolerance technique for TSVs-based multi-bit links through an efficient and effective use of redundancy. This technique is ideally suited for three-dimensional network-on-chip (NoC) links. Simulation results demonstrate significant yield improvement, from 66% to 98%, with a low area cost (17% on a vertical link in a NoC switch, which leads a modest 2.1% increase the total switch area) in 130nm technology, with minimal impact of VLSI design and test flows.

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