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On the modeling of resistance in graphene nanoribbon (GNR) for future interconnect applications
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International Conference on Computer Aided Design archive
Proceedings of the 2008 IEEE/ACM International Conference on Computer-Aided Design table of contents
San Jose, California
SESSION: Alternative circuit fabrics table of contents
Pages 593-597  
Year of Publication: 2008
ISBN ~ ISSN:1092-3152 , 978-1-4244-2820-5
Authors
Tamer Ragheb  Rice University, Houston TX
Yehia Massoud  Rice University, Houston TX
Sponsors
: IEEE CASS/CANDE
: IEEE Council on Electronic Design Automation (CEDA)
SIGDA: ACM Special Interest Group on Design Automation
Publisher
IEEE Press  Piscataway, NJ, USA
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ABSTRACT

In this paper, we present a comprehensive model for the resistance in graphene nanoribbon (GNR) interconnects. We use the recent experimental and theoretical results to model the impact of stacking of graphene layers in multi-layer GNR interconnects. We compare the resistance of GNR interconnects with both single-walled carbon nanotube (SWCNT) bundle interconnects and conventional copper interconnects. Our simulation results demonstrate the performance superiority of multi-layer GNR interconnects over conventional copper interconnects at small widths (< 15 nm). Consequently, multi-layer GNR interconnects demonstrate a great potential to replace conventioanl copper interconnects in future technologies.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
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Collaborative Colleagues:
Tamer Ragheb: colleagues
Yehia Massoud: colleagues