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Guiding global placement with wire density
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International Conference on Computer Aided Design archive
Proceedings of the 2008 IEEE/ACM International Conference on Computer-Aided Design table of contents
San Jose, California
SESSION: Placement table of contents
Pages 212-217  
Year of Publication: 2008
ISBN ~ ISSN:1092-3152 , 978-1-4244-2820-5
Authors
Kalliopi Tsota  Purdue University, West Lafayette, IN
Cheng-Kok Koh  Purdue University, West Lafayette, IN
Venkataramanan Balakrishnan  Purdue University, West Lafayette, IN
Sponsors
: IEEE CASS/CANDE
: IEEE Council on Electronic Design Automation (CEDA)
SIGDA: ACM Special Interest Group on Design Automation
Publisher
IEEE Press  Piscataway, NJ, USA
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Downloads (6 Weeks): 6,   Downloads (12 Months): 35,   Citation Count: 0
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ABSTRACT

This paper presents an efficient technique for the estimation of the routed wirelength during global placement using the wire density of the net. The proposed method identifies congested regions of the chip and incorporates the model of the routed wirelength into the objective function in order to effectively alleviate these regions from congestion. The method is integrated in the analytical placement framework and the two-level structure improves the scalability of the placer and speeds up the algorithm. The proposed analytical placer provides the best-so-far average routed wirelength in the IBM version2 benchmark suite.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
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Collaborative Colleagues:
Kalliopi Tsota: colleagues
Cheng-Kok Koh: colleagues
Venkataramanan Balakrishnan: colleagues