| Guiding global placement with wire density |
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International Conference on Computer Aided Design
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Proceedings of the 2008 IEEE/ACM International Conference on Computer-Aided Design
table of contents
San Jose, California
SESSION: Placement
table of contents
Pages 212-217
Year of Publication: 2008
ISBN ~ ISSN:1092-3152 , 978-1-4244-2820-5
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IEEE Press
Piscataway, NJ, USA
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Downloads (6 Weeks): 6, Downloads (12 Months): 35, Citation Count: 0
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ABSTRACT
This paper presents an efficient technique for the estimation of the routed wirelength during global placement using the wire density of the net. The proposed method identifies congested regions of the chip and incorporates the model of the routed wirelength into the objective function in order to effectively alleviate these regions from congestion. The method is integrated in the analytical placement framework and the two-level structure improves the scalability of the placer and speeds up the algorithm. The proposed analytical placer provides the best-so-far average routed wirelength in the IBM version2 benchmark suite.
REFERENCES
Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.
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