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3D configuration caching for 2D FPGAs
Source
International Symposium on Field Programmable Gate Arrays archive
Proceeding of the ACM/SIGDA international symposium on Field programmable gate arrays table of contents
Monterey, California, USA
POSTER SESSION: Architectures & applications table of contents
Pages 286-286  
Year of Publication: 2009
ISBN:978-1-60558-410-2
Authors
Alessandro Cevrero  Ecole Polytechnique Fédérale de Lausanne (EPFL), Lausanne, Switzerland
Panagiotis Athanasopoulos  Ecole Polytechnique Fédérale de Lausanne (EPFL), Lausanne, Switzerland
Hadi Parandeh-Afshar  Ecole Polytechnique Fédérale de Lausanne (EPFL), Lausanne, Switzerland
Philip Brisk  Ecole Polytechnique Fédérale de Lausanne (EPFL), Lausanne, Switzerland
Yusuf Lebebici  Ecole Polytechnique Fédérale de Lausanne (EPFL), Lausanne, Switzerland
Paolo Ienne  Ecole Polytechnique Fédérale de Lausanne (EPFL), Lausanne, Switzerland
Maurizio Skerlj  Qimonda AG, Munich, Germany
Sponsors
SIGDA: ACM Special Interest Group on Design Automation
ACM: Association for Computing Machinery
Publisher
ACM  New York, NY, USA
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ABSTRACT

This poster proposes the use of 3D integration technology to enable low-overhead reconfigurable computing. In our scheme, a 64 Megabyte DRAM array is stacked on top of an FPGA using face-to-face bonding, and caches up to 289 future configurations which can be quickly loaded onto the FPGA. Past DRAMs have been designed for off-chip communication, a bottleneck that 3D stacking eliminates; hence, the DRAM array is redesigned. To reconfigure the FPGA, a configuration is read from the DRAM into a latch array while the FPGA executes; then, the configuration is loaded from the latch array into the FPGA in 5 cycles (60ns). The minimum latency between reconfigurations, 8.42s, is dominated by the time to load data from the DRAM into the latch array. The benefits, area cost, and performance of the proposed system are evaluated on three previously published FPGA implementations of multimedia applications: MP3 and MPEG-4 decoders, and JPEG compression, and are evaluated under three scenarios: No Dynamic ReConfiguration (NDRC), Off-chip Dynamic ReConfiguration (ORDC), and 3D Configuration Caching (3DCC). Our experiments demonstrate that 3D configuration caching works best when used in conjunction with FPGA-based accelerators, rather than pure FPGA-based systems; in these systems, the reconfiguration latency can easily be hidden behind software execution on the processor controlling the accelerator. This significantly reduces the amount of silicon area that must be dedicated to the accelerator, while imposing virtually no performance penalty compared to significantly larger accelerators that do not require reconfiguration.


Collaborative Colleagues:
Alessandro Cevrero: colleagues
Panagiotis Athanasopoulos: colleagues
Hadi Parandeh-Afshar: colleagues
Philip Brisk: colleagues
Yusuf Lebebici: colleagues
Paolo Ienne: colleagues
Maurizio Skerlj: colleagues