High-performance, cost-effective heterogeneous 3D FPGA architectures

ABSTRACT

In this paper, we propose novel architectural and design techniques for three-dimensional field-programmable gate arrays (3D FPGAs) with Through-Silicon Vias (TSVs). We develop a novel design partitioning methodology that maps the heterogeneous computational resources of an FPGA into a number of die such that the total die area is minimized and the FPGA performance is maximized. Minimizing the total die area leads to direct manufacturing cost savings which is an important incentive to bring 3D technology to the fab and onto the market. An estimation framework is developed to assess the impact of silicon area utilized by 3D interconnect resources while taking into account the large area occupied by TSVs which is crucial to total die area of 3D FPGA. And in order to improve area and performance of 3D FPGA, we design a novel 3D switch box with bypass TSVs. We also analyze the impact of different partitioning strategies on die area and find the optimal number of die that gives the largest reductions in total die area while maximizing the performance. Using a well-developed simulation infrastructure, we show that our methodologies can achieve an average reduction of 27.7% in total die area with a reduced interconnect path delay of about 58%.

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INDEX TERMS

Primary Classification:
  B. Hardware
  B.7 INTEGRATED CIRCUITS
      B.7.1 Types and Design Styles
          Subjects: Advanced technologies

General Terms:
Design, Economics, Performance

Keywords:
3d ic, fpga, heterogeneous, switch box, through silicon via