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FIDES: An advanced chip multiprocessor platform for secure next generation mobile terminals
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ACM Transactions on Embedded Computing Systems (TECS) archive
Volume 8 ,  Issue 1  (December 2008) table of contents
Article No. 1  
Year of Publication: 2008
ISSN:1539-9087
Authors
Hiroaki Inoue  System IP Core Research Laboratories, NEC Corporation, Kanagawa, Japan
Junji Sakai  System IP Core Research Laboratories, NEC Corporation, Kanagawa, Japan
Sunao Torii  System IP Core Research Laboratories, NEC Corporation, Kanagawa, Japan
Masato Edahiro  System IP Core Research Laboratories, NEC Corporation, Kanagawa, Japan
Publisher
ACM  New York, NY, USA
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ABSTRACT

We propose a secure platform on a chip multiprocessor, FIDES, in order to enable next generation mobile terminals to execute downloaded native applications for Linux. Its most important feature is the higher security based on multigrained separation mechanisms. Four new technologies support the FIDES platform: bus filter logic, XIP kernels, policy separation, and dynamic access control. With these technologies, the FIDES platform can tolerate both application-level and kernel-level bugs on an actual download subsystem. Thus, the best-suited platform to secure next generation mobile terminals is FIDES.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
1
Alves, T. and Felton, D. 2004. TrustZone: Integrated Hardware and Software Security. http://www.arm.com/pdfs/TZ%20Whitepaper.pdf.
 
2
ARM. 1999. AMBA Specification Rev.2.0. http://www.arm.com/products/solutions/AMBA_Spec. html.
 
3
 
4
 
5
Bird, T. 2004. Methods to improve bootup time in Linux. In Proceedings of the Ottawa Linux Symposium. 79--88.
 
6
BREW. 2002. The road to profit is paved with data revenue. http://brew.qualcomm.com/brew/en/img/about/pdf/brew_white_paper.pdf.
 
7
 
8
 
9
Esia, Jeita, Ksia, Tsia, and Sia. 2003. International technology roadmap for semiconductors. http://public.itrs.net/Files/2003ITRS/ExecSum2003.pdf.
 
10
 
11
12
 
13
Intel. 2005. Intel virtualization technology specification for the IA-32 Intel architecture. ftp://download.intel.com/technology/computing/vptech/C97063-002.pdf.
 
14
 
15
NTT DOCOMO, IBM and INTEL. 2004. Trusted mobile platform hardware architecture description. http://xml.coverpages.org/TMP-HWADv10.pdf.
 
16
OPENWALL PROJECT. 2001. Linux kernel patch from the Openwall project. http://www.openwall.com/linux/README.shtml.
 
17
Sakai, J., Inoue, H., Abe, T., Suzuki, N., Uekubo, M., Ito, Y., Suzuki, K., Kondo, M., and Edahiro, M. 2005. Multi-tasking parallel method on MP211 multi-core application processor. In Proceedings of the IEEE Symposium on Low-Power and High-Speed Chips. 198--211.
 
18
SECURE SOFTWARE. 2001. Rough auditing tool for security (RATS). http://www.securesoftware.com/rats.php.
 
19
 
20
Torii, S., Suzuki, S., Tomonaga, H., Tokue, T., Sakai, J., Suzuki, N., Murakami, K., Hiraga, T., Shigemoto, K., Tatebe, Y., Obuchi, E., Kayama, N., Edahiro, M., Kusano, T., and Nishi, N. 2005. A 600MIPS 120mW 70uA leakage triple-CPU mobile application processor chip. In Proceedings of the IEEE International Solid-State Circuits Conference. 136--137.
 
21
Torii, S., Sakai, J., Inoue, H., Tokue, T., and Ito, Y. 2005. Asymmetric multi-processing mobile application processor MP211. NEC J. Advan. Tech. 2, 3, 204--210.

Collaborative Colleagues:
Hiroaki Inoue: colleagues
Junji Sakai: colleagues
Sunao Torii: colleagues
Masato Edahiro: colleagues