|
ABSTRACT
The test time for core-external interconnect shorts and opens is typically much less than that for core-internal logic. Therefore, prior work on test-infrastructure design for core-based system-on-a-chip (SOC) has mainly focused on minimizing the test time for core-internal logic. However, as feature sizes shrink for newer process technologies, the test time for signal integrity (SI) faults on interconnects cannot be neglected. The test time for SI faults can be comparable to, or even larger than, the test time for the embedded cores. We investigate the impact of interconnect SI tests on SOC test-architecture design and optimization. A compaction method for SI faults and algorithms for test-architecture optimization are also presented. Experimental results for the ITC'02 benchmarks show that the proposed approach can significantly reduce the overall testing time for core-internal logic and core-external interconnects.
REFERENCES
Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.
 |
1
|
|
| |
2
|
|
 |
3
|
Xiaoliang Bai , Sujit Dey , Janusz Rajski, Self-test methodology for at-speed test of crosstalk in chip interconnects, Proceedings of the 37th conference on Design automation, p.619-624, June 05-09, 2000, Los Angeles, California, United States
[doi> 10.1145/337292.337597]
|
| |
4
|
Becer, M., Vaidyanathan, R., Oh, C., and Panda, R. 2004. Crosstalk noise control in an SoC physical design flow. IEEE Trans. Comput. Aid. D. 23, 4, 488--497.
|
| |
5
|
Caignet, F., Delmas-Bendhia, S., and Sicard, E. 2001. The challenge of signal integrity in deep-submicrometer CMOS technology. In Proceedings of the IEEE 89, 4, 556--573.
|
 |
6
|
|
| |
7
|
Chen, T.-S., Lee, C.-Y., and Kao, C.-H. 2004. An efficient noise isolation technique for SOC application. IEEE Trans. Electr. Dev. 51, 2, 255--260.
|
| |
8
|
|
| |
9
|
Michael Cuviello , Sujit Dey , Xiaoliang Bai , Yi Zhao, Fault modeling and simulation for crosstalk in system-on-chip interconnects, Proceedings of the 1999 IEEE/ACM international conference on Computer-aided design, p.297-303, November 07-11, 1999, San Jose, California, United States
|
| |
10
|
|
| |
11
|
|
| |
12
|
|
| |
13
|
|
| |
14
|
Sandeep Kumar Goel , Kuoshu Chiu , Erik Jan Marinissen , Toan Nguyen , Steven Oostdijk, Test Infrastructure Design for the Nexperia" Home Platform PNX8550 System Chip, Proceedings of the conference on Design, automation and test in Europe, p.30108, February 16-20, 2004
|
| |
15
|
|
| |
16
|
Guler, M. and Kilic, H. 1999. Understanding the importance of signal integrity. IEEE Circuits Devic. 15, 6, 7--10.
|
| |
17
|
IEEE Std. 1500. 2004. IEEE Standard for Embedded Core Test—IEEE Std. 1500-2004. IEEE, New York.
|
| |
18
|
|
| |
19
|
|
| |
20
|
Kao, W. H., Lo, C.-Y., Basel, M., and Singh, R. 2001. Parasitic extraction: current state of the art and future trends. In Proceedings of the IEEE 89, 5, 729--739.
|
| |
21
|
Kundu, S., Zachariah, S. T., Chang, Y.-S., and Tirumurti, C. 2005. On modeling crosstalk faults. IEEE Trans. Comput. Aid. D. 24, 12, 1909--1915.
|
| |
22
|
|
| |
23
|
|
| |
24
|
Erik Jan Marinissen , Robert G. J. Arendsen , Gerard Bos , Hans Dingemanse , Maurice Lousberg , Clemens Wouters, A structured and scalable mechanism for test access to embedded reusable cores, Proceedings of the 1998 IEEE International Test Conference, p.284-293, October 18-22, 1998
|
| |
25
|
|
| |
26
|
|
| |
27
|
Massoud, Y., Majors, S., Kawa, J., Bustami, T., MacMillen, D., and White, J. 2002. Managing On-Chip Inductive Effects. 10, 6 (December), 789--798.
|
| |
28
|
Naffziger, S. 1999. Design methodologies for interconnects in GHz+ICs. In Proceedings of the International Solid State Circuits Conference (ISSCC).
|
| |
29
|
Nahvi, M. and Ivanov, A. 2004. Indirect test architecture for SoC testing. IEEE Trans. Comput. Aid. 23, 7, 1128--1142.
|
| |
30
|
|
| |
31
|
P. Nordholz , D. Treytnar , J. Otterstedt , H. Grabinski , D. Niggemeyer , T. W. Williams, 2.2 Signal Integrity Problems in Deep Submicron Arising from Interconnects between Cores, Proceedings of the 16th IEEE VLSI Test Symposium, p.28, April 26-30, 1998
|
 |
32
|
|
| |
33
|
|
| |
34
|
|
| |
35
|
|
| |
36
|
|
| |
37
|
|
| |
38
|
Tehranipour, M. H., Ahmed, N., and Nourani, M. 2004. Testing SoC interconnects for signal integrity using extended JTAG architecture. IEEE Trans. Comput. Aid. D. 23, 5, 800--811.
|
| |
39
|
|
| |
40
|
Wang, L.-T., Stround, C. E., and Touba, N. A., Eds. 2007. System-on-Chip Test Architectures: Nanometer Design for Testability. Morgan Kaufmann Pub.
|
| |
41
|
Xu, Q. and Nicolici, N. 2003. On reducing wrapper boundary register cells in modular SOC testing. In Proceedings of the IEEE International Test Conference (ITC), 622--631.
|
| |
42
|
|
| |
43
|
Xu, Q. and Nicolici, N. 2005. Resource-constrained system-on-a-chip test: a survey. In Proceedings of the IEEE Conference on Computers and Digital Techniques 152, 1, 67--81.
|
| |
44
|
Xu, Q. and Nicolici, N. 2006. Multifrequency tam design for hierarchical socs. IEEE Trans. Comput. Aid. D. 25, 1, 181--196.
|
 |
45
|
|
| |
46
|
|
| |
47
|
Zhao, D. and Upadhyaya, S. 2005. Dynamically partitioned test scheduling with adaptive TAM configuration for power-constrained SoC testing. IEEE Trans. Comput. Aid. D. 24, 6, 956--965.
|
| |
48
|
|
| |
49
|
|
|