ACM Home Page
Please provide us with feedback. Feedback
Synergistic modeling and optimization for nanometer IC design/manufacturing integration
Full text PdfPdf (145 KB)
Source
SBCCI archive
Proceedings of the 21st annual symposium on Integrated circuits and system design table of contents
Gramado, Brazil
TUTORIAL SESSION: Tutorials table of contents
Pages 2-2  
Year of Publication: 2008
ISBN:978-1-60558-231-3
Author
David Z. Pan  University of Texas at Austin, Austin, TX, USA
Sponsors
ACM: Association for Computing Machinery
SIGDA: ACM Special Interest Group on Design Automation
Publisher
ACM  New York, NY, USA
Bibliometrics
Downloads (6 Weeks): 0,   Downloads (12 Months): 20,   Citation Count: 0
Additional Information:

abstract   index terms   collaborative colleagues  

Tools and Actions: Review this Article  
DOI Bookmark: Use this link to bookmark this Article: http://doi.acm.org/10.1145/1404371.1404374
What is a DOI?

ABSTRACT

Nanometer IC design and manufacturing are facing unprecedented grand challenges for 45nm and beyond, according to ITRS. On one hand, many entangled physical effects continue to pose tremendous challenges to reach design closure with stringent turn-around-time; on the other hand, design closure no longer guarantees manufacturing closure. The conventional contracts between design and fab through design rules are breaking, due to deep sub-wavelength lithography and growing process variations. Thus design/manufacturing integration and co-optimization will become more and more important. To enable true design/process integration, it is crucial to be able to model proper manufacturing/variability/yield metrics, and feed them upstream at various physical design implementation stages. This lecture will present synergistic modeling and optimization issues on both physical and electrical design for manufacturing (DFM). We will seek to address DFM from its root causes, in a holistic manner through better manufacturing for design (e.g., variation aware lithography modeling and optical proximity correction), manufacturing-design interface (e.g., predictive silicon modeling and variational circuit analysis), and true design for manufacturing (e.g., manufacturability aware routing and variational aware clock synthesis).