Proactive temperature management in MPSoCs

ABSTRACT

Preventing thermal hot spots and large temperature variations on the die is critical for addressing the challenges in system reliability, performance, cooling cost and leakage power. Reactive thermal management methods, which take action after temperature reaches a given threshold, maintain the temperature below a critical level at the cost of performance, and do not address the temperature variations. In this work, we propose a proactive thermal management approach, which estimates the future temperature using regression, and allocates workload on a multicore system to reduce and balance the temperature to avoid temperature induced problems. Our technique reduces the hot spots and temperature variations significantly in comparison to reactive strategies.

REFERENCES

• 1: A. H. Ajami, K. Banerjee, and M. Pedram. Modeling and analysis of nonuniform substrate temperature effects on global ULSI interconnects. IEEE Transactions on CAD, 24(6):849--861, June 2005.
• 2: David Atienza , Giovanni De Micheli , Luca Benini , José L. Ayala , Pablo G. Del Valle , Michael DeBole , Vijay Narayanan, Reliability-aware design for nanometer-scale devices, Proceedings of the 2008 conference on Asia and South Pacific design automation, January 21-24, 2008, Seoul, Korea
• 3: David Atienza , Pablo G. Del Valle , Giacomo Paci , Francesco Poletti , Luca Benini , Giovanni De Micheli , Jose M. Mendias, A fast HW/SW FPGA-based thermal emulation framework for multi-processor system-on-chip, Proceedings of the 43rd annual conference on Design automation, July 24-28, 2006, San Francisco, CA, USA [doi>10.1145/1146909.1147068]
• 4: Ayse Kivilcim Coskun , Tajana Simunic Rosing , Keith Whisnant, Temperature aware task scheduling in MPSoCs, Proceedings of the conference on Design, automation and test in Europe, April 16-20, 2007, Nice, France
• 5: James Donald , Margaret Martonosi, Techniques for Multicore Thermal Management: Classification and New Exploration, Proceedings of the 33rd annual international symposium on Computer Architecture, p.78-88, June 17-21, 2006
• 6: Mohamed Gomaa , Michael D. Powell , T. N. Vijaykumar, Heat-and-run: leveraging SMT and CMP to manage power density through the operating system, Proceedings of the 11th international conference on Architectural support for programming languages and operating systems, October 07-13, 2004, Boston, MA, USA
• 7: K. Gross, K. Whisnant, and A. Urmanov. Electronic prognostics through continuous system telemetry. In MFPT, pages 53--62, April 2006.
• 8: Jingcao Hu , Radu Marculescu, Energy-Aware Communication and Task Scheduling for Network-on-Chip Architectures under Real-Time Constraints, Proceedings of the conference on Design, automation and test in Europe, p.10234, February 16-20, 2004
• 9: W-L. Hung , Y. Xie , N. Vijaykrishnan , M. Kandemir , M. J. Irwin, Thermal-Aware Task Allocation and Scheduling for Embedded Systems, Proceedings of the conference on Design, Automation and Test in Europe, p.898-899, March 07-11, 2005 [doi>10.1109/DATE.2005.310]
• 10: Failure mechanisms and models for semiconductor devices, JEDEC publication JEP122C. http://www.jedec.org.
• 11: H. Kufluoglu and M. A. Alam. A computational model of NBTI and hot carrier injection time-exponents for MOSFET reliability. Journal of Computational Electronics, 3 (3):165--169, Oct. 2004.
• 12: Amit Kumar , Li Shang , Li-Shiuan Peh , Niraj K. Jha, HybDTM: a coordinated hardware-software approach for dynamic thermal management, Proceedings of the 43rd annual conference on Design automation, July 24-28, 2006, San Francisco, CA, USA [doi>10.1145/1146909.1147052]
• 13: A. Leon, L. Jinuk, K. Tam, W. Bryg, F. Schumacher, P. Kongetira, D. Weisner, and A. Strong. A power-efficient high-throughput 32-thread SPARC processor. ISSCC, 2006.
• 14: Jinfeng Liu , Pai H. Chou , Nader Bagherzadeh , Fadi Kurdahi, Power-aware scheduling under timing constraints for mission-critical embedded systems, Proceedings of the 38th conference on Design automation, p.840-845, June 2001, Las Vegas, Nevada, United States [doi>10.1145/378239.379076]
• 15: Madhu Mutyam , Feihui Li , Vijaykrishnan Narayanan , Mahmut Kandemir , Mary Jane Irwin, Compiler-directed thermal management for VLIW functional units, Proceedings of the 2006 ACM SIGPLAN/SIGBED conference on Language, compilers, and tool support for embedded systems, June 14-16, 2006, Ottawa, Ontario, Canada
• 16: P. Rong and M. Pedram. Power-aware scheduling and dynamic voltage setting for tasks running on a hard real-time system.
• 17: Tajana Simunic Rosing , Kresimir Mihic , Giovanni De Micheli, Power and reliability management of SoCs, IEEE Transactions on Very Large Scale Integration (VLSI) Systems, v.15 n.4, p.391-403, April 2007 [doi>10.1109/TVLSI.2007.895245]
• 18: Martino Ruggiero , Alessio Guerri , Davide Bertozzi , Francesco Poletti , Michela Milano, Communication-aware allocation and scheduling framework for stream-oriented multi-processor systems-on-chip, Proceedings of the conference on Design, automation and test in Europe: Proceedings, March 06-10, 2006, Munich, Germany
• 19: Kevin Skadron , Mircea R. Stan , Wei Huang , Sivakumar Velusamy , Karthik Sankaranarayanan , David Tarjan, Temperature-aware microarchitecture, Proceedings of the 30th annual international symposium on Computer architecture, June 09-11, 2003, San Diego, California
• 20: SLAMD Distributed Load Engine. www.slamd.com.
• 21: Jayanth Srinivasan , Sarita V. Adve , Pradip Bose , Jude A. Rivers, The Case for Lifetime Reliability-Aware Microprocessors, Proceedings of the 31st annual international symposium on Computer architecture, p.276, June 19-23, 2004, München, Germany
• 22: Haihua Su , Frank Liu , Anirudh Devgan , Emrah Acar , Sani Nassif, Full chip leakage estimation considering power supply and temperature variations, Proceedings of the 2003 international symposium on Low power electronics and design, August 25-27, 2003, Seoul, Korea [doi>10.1145/871506.871529]
• 23: Yumin Zhang , Xiaobo Sharon Hu , Danny Z. Chen, Task scheduling and voltage selection for energy minimization, Proceedings of the 39th conference on Design automation, June 10-14, 2002, New Orleans, Louisiana, USA [doi>10.1145/513918.513966]

INDEX TERMS

Primary Classification:
  B. Hardware
  B.8 Performance and Reliability
      B.8.0 General

Additional Classification:
  C. Computer Systems Organization
  C.4 PERFORMANCE OF SYSTEMS

General Terms:
Design, Management, Reliability

Keywords:
ARMA, multiprocessor, thermal management