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ABSTRACT
The threshold voltage (Vth) of a nanoscale transistor is severely affected by random dopant fluctuations and line-edge roughness. The analysis of these effects usually requires atomistic simulations that are too expensive computationally for statistical circuit design. In this work, we develop an efficient SPICE simulation method and statistical transistor model that accurately predict threshold variation as a function of dopant fluctuations and gate length change caused by sub-wavelength lithography and gate etching process. By understanding the physical principles of atomistic simulations, we (a) identify the appropriate method to divide a non-uniform gate into slices in order to map those fluctuations into the device model; (b) extract the variation of Vth from the strong-inversion region instead of the leakage current, benefiting from the linearity of the saturation current with respect to Vth and (c) propose a compact model of Vth variation that is scalable with gate size and the amount of dopant and gate length fluctuations. The proposed SPICE simulation method is fully validated against atomistic simulation results. Given the post-lithography gate geometry, this approach correctly models the variation of device output current in all operating regions. Based on the new results, we further project the amount of Vth variation at advanced technology nodes, to help shed light on the challenges of future robust circuit design.
REFERENCES
Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.
| |
1
|
International Technology Roadmap for Semiconductors, 2006.
|
| |
2
|
K. Bernstein , D. J. Frank , A. E. Gattiker , W. Haensch , B. L. Ji , S. R. Nassif , E. J. Nowak , D. J. Pearson , N. J. Rohrer, High-performance CMOS variability in the 65-nm regime and beyond, IBM Journal of Research and Development, v.50 n.4/5, p.433-449, July 2006
|
| |
3
|
|
| |
4
|
B. Cheng, S. Roy, G. Roy, F. Adamu-Lema, A. Asenov, "Impact of intrinsic parameter fluctuations in decanano MOSFETs on yield and functionality of SRAM cells," Elsevier Solid-State Electronics, vol. 49, pp. 740--746, 2005.
|
| |
5
|
A. Asenov, A. R. Brown, J. H. Davies, S. Kaya, G. Slavcheva, "Simulation of intrinsic parameter fluctuations in decananometer and nanometer-scale MOSFETs," IEEE TED, vol. 50, no. 9, pp. 1837--1852, Sep. 2003.
|
| |
6
|
D. J. Frank, Y. Taur, M. Ieong, and H.-S. P. Wong, "Monte Carlo modeling of threshold variation due to dopant fluctuations," Symp. VLSI Circuits, pp. 171--172, 1999.
|
| |
7
|
J. A. Croon et al., "Line edge roughness: Characterization, modeling and impact on device behavior," IEDM, pp. 307--310, 2002.
|
 |
8
|
Ritu Singhal , Asha Balijepalli , Anupama Subramaniam , Frank Liu , Sani Nassif , Yu Cao, Modeling and analysis of non-rectangular gate for post-lithography circuit simulation, Proceedings of the 44th annual conference on Design automation, June 04-08, 2007, San Diego, California
[doi> 10.1145/1278480.1278685]
|
| |
9
|
J. J. M. Pelgrom, A. C. J. Duinmaijer, A. P. G. Welbers, "Matchign properties of MOS transistors," IEEE JSSC, vol. 24, no. 5, pp. 1433--1440, Oct. 1989.
|
| |
10
|
K. Takeuchi, "Channel size dependence of dopant-induced threshold voltage fluctuation," Symp. VLSI Technology, pp. 72--73, 1998.
|
| |
11
|
W. Zhao, Y. Cao, "New generation of predictive technology model for sub-45nm design exploration," IEEE TED, vol. 53, no. 11, pp. 2816--2823, Nov. 2006. (Available at http://www.eas.asu.edu/~ptm)
|
| |
12
|
|
| |
13
|
P. Gupta, A. Kahng, Y. Kim, S. Shah, D. Sylvester, "Modeling of non-uniform device geometries for post-lithography circuit analysis", SPIE, vol. 6156, 2006.
|
| |
14
|
J. Wu, J. Chen, K. Liu, "Transistor width dependence of LER degradation to CMOS device characteristics,"SISPAD, pp. 95--98, 2002.
|
| |
15
|
S.-D. Kim, H. Wada, J. C. S. Woo, "TCAD-based statistical analysis and modeling of gate line-edge roughness effect on nanoscale MOS transistor performance and scaling." IEEE TSM, vol. 17, no. 2, pp. 192--200, May, 2004.
|
| |
16
|
T. Jhaveri et al., "Maximization of layout printability/manufacturability by extreme layout regularity," J. Micro/Nanolitho., MEMS and MOEMS, vol. 6, no. 3, 031011, Jul.-Sep. 2007.
|
|