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A power and temperature aware DRAM architecture
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Source Annual ACM IEEE Design Automation Conference archive
Proceedings of the 45th annual Design Automation Conference table of contents
Anaheim, California
SESSION: Topics in power and thermal management table of contents
Pages 878-883  
Year of Publication: 2008
ISBN ~ ISSN:0738-100X , 978-1-60558-115-6
Authors
Song Liu  Northwestern University, Evanston, IL
Seda Ogrenci Memik  Northwestern University, Evanston, IL
Yu Zhang  Northwestern University, Evanston, IL
Gokhan Memik  Northwestern University, Evanston, IL
Sponsors
SIGDA: ACM Special Interest Group on Design Automation
: IEEE/CASS/CANDE/CEDA
: The EDA Consortium
Publisher
ACM  New York, NY, USA
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ABSTRACT

Technological advances enable modern processors to utilize increasingly larger DRAMs with rising access frequencies. This is leading to high power consumption and operating temperature in DRAM chips. As a result, temperature management has become a real and pressing issue in high performance DRAM systems. Traditional low power techniques are not suitable for high performance DRAM systems with high bandwidth. In this paper, we propose and evaluate a customized DRAM low power technique based on Page Hit Aware Write Buffer (PHA-WB). Our proposed approach reduces DRAM system power consumption and temperature without any performance penalty. Our experiments show that a system with a 64-entry PHA-WB could reduce the total DRAM power consumption by up to 22.0% (9.6% on average). The peak and average temperature reductions are 6.1°C and 2.1°C, respectively.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
1
Standard Performance Evaluation Corporation. SPEC CPU2000. http://www.spec.org.
 
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3
4
 
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JEDEC, FBDIMM Specification: DDR2 SDRAM Fully Buffered DIMM (FBDIMM) Design Specification http://www.jedec.org/download/search/JESD2051.pdf.
 
6
JEDEC, FBDIMM: Advanced Memory Buffer (AMB) http://www.jedec.org/download/search/JESD82--20.pdf.
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Lin, J., H. Zheng, Z. Zhu, Z. Zhang, and D. H., DRAM-level prefetching for fully-buffered DIMM: design, performance and power saving, in ISPASS '07. 2007.
 
10
Micron, Calculating Memory System Power for DDR2.
 
11
Micron, DDR2 SDRAM http://download.micron.com/pdf/datasheets/dram/ddr2/512 MbDDR2.pdf.
 
12
Micron, System Power Calculator, http://www.micron.com/support/designsupport/tools/power calc/powercalc.aspx.
 
13
Rambus, RDRAM, in www.rambus.com.
 
14
Shivakumar, P. and N. P. Jouppi, CACTI 3.0: An Integrated Cache Timing, Power, and Area Model WRL Research Report.

Collaborative Colleagues:
Song Liu: colleagues
Seda Ogrenci Memik: colleagues
Yu Zhang: colleagues
Gokhan Memik: colleagues