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Stochastic modeling of a thermally-managed multi-core system
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Source Annual ACM IEEE Design Automation Conference archive
Proceedings of the 45th annual Design Automation Conference table of contents
Anaheim, California
SESSION: Power and thermal considerations in single- and multi-core systems table of contents
Pages 728-733  
Year of Publication: 2008
ISBN ~ ISSN:0738-100X , 978-1-60558-115-6
Authors
Hwisung Jung  University of Southern California, Los Angeles, CA
Peng Rong  ASIC Development, Brocade Communications Systems, San Jose, CA
Massoud Pedram  University of Southern California, Los Angeles, CA
Sponsors
SIGDA: ACM Special Interest Group on Design Automation
: IEEE/CASS/CANDE/CEDA
: The EDA Consortium
Publisher
ACM  New York, NY, USA
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ABSTRACT

Achieving high performance under a peak temperature limit is a first-order concern for VLSI designers. This paper presents a new abstract model of a thermally-managed system, where a stochastic process model is employed to capture the system performance and thermal behavior. We formulate the problem of dynamic thermal management (DTM) as the problem of minimizing the energy cost of the system for a given level of performance under a peak temperature constraint by using a controllable Markovian decision process (MDP) model. The key rationale for utilizing MDP for solving the DTM problem is to manage the stochastic behavior of the temperature states of the system under online re-configuration of its micro-architecture and/or dynamic voltage-frequency scaling. Experimental results demonstrate the effectiveness of the modeling framework and the proposed DTM technique.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

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Collaborative Colleagues:
Hwisung Jung: colleagues
Peng Rong: colleagues
Massoud Pedram: colleagues