Keeping hot chips cool: are IC thermal problems hot air?

ABSTRACT

Thermal issues are becoming more important but is the hype getting the better of the facts? Does this deserve more attention than for some niche designs and technologies such as 3D ICs.? Does the broader design community need to worry about it at 32nm and beyond or it will only impact a small segment of designs? In short, does the severity of power issues coupled with packaging complexity translate into a thermal crisis in future? This is an educational panel with a little bit of controversy that will address the thermal issue in IC design. When will this issue be emerging as a crucial concern if at all? What are the solutions to resolve this potential crisis?

INDEX TERMS

Primary Classification:
  B. Hardware
  B.7 INTEGRATED CIRCUITS
      B.7.2 Design Aids

General Terms:
Algorithms, Design, Measurement, Performance

Keywords:
VLSI design, power dissipation, thermal management