Electric field integral equation combined with cylindrical conduction mode basis functions for electrical modeling of three-dimensional interconnects

Subscribe (Full Service)


	Search: The ACM Digital Library The Guide

	Feedback

Electric field integral equation combined with cylindrical conduction mode basis functions for electrical modeling of three-dimensional interconnects

Full text

Pdf (3.57 MB)

Source

Annual ACM IEEE Design Automation Conference archive
Proceedings of the 45th annual Design Automation Conference table of contents

Anaheim, California

SESSION: Extraction, interconnect and timing table of contents

Pages 421-424

Year of Publication: 2008

ISBN ~ ISSN:0738-100X , 978-1-60558-115-6

Authors

Ki Jin Han	Georgia Institute of Technology, Atlanta, Georgia
Madhavan Swaminathan	Georgia Institute of Technology, Atlanta, Georgia
Ege Engin	Georgia Institute of Technology, Atlanta, Georgia

Sponsors

SIGDA: ACM Special Interest Group on Design Automation
: IEEE/CASS/CANDE/CEDA
: The EDA Consortium

Publisher

ACM New York, NY, USA

Bibliometrics

Downloads (6 Weeks): 8, Downloads (12 Months): 44, Citation Count: 0

Additional Information:

abstract references cited by index terms collaborative colleagues

Tools and Actions:	Request Permissions Review this Article Save this Article to a Binder Display Formats: BibTeX EndNote ACM Ref

DOI Bookmark:	Use this link to bookmark this Article: http://doi.acm.org/10.1145/1391469.1391579 What is a DOI?

ABSTRACT

For the modeling of interconnect in three-dimensional packagings, this paper proposes a method based on the electric field integral equation (EFIE) with cylindrical conduction mode basis functions (CMBF). The bases are defined to describe arbitrary skin and proximity effects, and partial impedances are obtained from the formulation of the EFIE with CMBF's. Examples of several 3-D interconnects verify that the proposed method is efficient in speed and memory.

REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

	1	L. Daniel, J. White, and A. Sangiovanni-Vincentelli. Interconnect Electromagnetic Modeling using Conduction Modes as Global Basis Functions. In Proc. Topical Meeting Electr. Performance Electron. Packag., pages 84--89. IEEE, Oct. 2000.
	2	F. W. Grover. Inductance Calculations - Working Formulas and Tables. Dover Publications, Mineola, New York, 1946.
	3	K. J. Han, E. Engin, and M. Swaminathan. Cylindrical Conduction Mode Basis Functions for Modeling of Inductive Couplings in System-in-Package (SiP). In Proc. Topical Meeting Electr. Performance Electron. Packag., pages 361--364. IEEE, Oct. 2007.
	4	M. Kamon, M. J. Tsuk, and J. K. White. FASTHENRY: A Multipole-Accelerated 3-D Inductance Extraction Program. IEEE Trans. Microw. Theory Tech., 42(9): 1750--1758, Sep. 1994.
	5	H. Patterson. Analysis of Ground Bond Wire Arrays For RFICs. In Proc. Radio Frequency Integrated Circuits Symp., pages 237--240. IEEE, Jun. 1997.
	6	S. Ray, A. K. Gogoi, and R. K. Mallik. Closed Form Expression for Mutual Partial Inductance between Two Skewed Linear Current Segments. In Proc. Antennas and Propagation Society Int. Symp., pages 1278--1281. IEEE, Jul. 1999.
	7	A. E. Ruehli. Equivalent Circuit Models for Three-Dimensional Multiconductor Systems. IEEE Trans. Microw. Theory Tech., 22(3):216--221, Mar. 1974.