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ABSTRACT

In this paper we propose to replace all data and control pads generally present in conventional chips with a new type of ultra-compact, low-power optical interconnect implemented almost entirely in CMOS. The proposed scheme enables optical through-chip buses that could service hundreds of thinned stacked dies. High throughputs and communication density could be achieved even in tight power budgets. The core of the optical interconnect is a single-photon avalanche diode operating in pulse position modulation. We demonstrate how throughputs of several gigabits per second may be achieved. We also show a systematic analysis of the system and preliminary results to support its suitability in emerging DSM technologies.

REFERENCES

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INDEX TERMS

Primary Classification:
  B. Hardware
  B.4 INPUT/OUTPUT AND DATA COMMUNICATIONS
      B.4.3 Interconnections (subsystems)

General Terms:
Design, Performance, Reliability

Keywords:
intra-chip & inter-chip communication, low power optical communication, miniaturized optical channel and detector