RF interconnects for communications on-chip

ABSTRACT

In this paper, we propose a new way of implementing on-chip global interconnect that would meet stringent challenges of core-to-core communications in latency, data rate, and re-configurability for future chip-microprocessors (CMP) with efficient area and energy overheads. We discuss the limitation of traditional RC-limited interconnects and possible benefits of multi-band RF-interconnect (RF-I) through on-chip differential transmission lines. The physical implementation of RF-I and its projected performance versus overhead as the function of CMOS technology scaling are discussed as well

REFERENCES

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INDEX TERMS

Primary Classification:
  B. Hardware
  B.7 INTEGRATED CIRCUITS
      B.7.1 Types and Design Styles
          Subjects: Advanced technologies

Additional Classification:
  B. Hardware
  B.7 INTEGRATED CIRCUITS
      B.7.1 Types and Design Styles
          Subjects: Microprocessors and microcomputers; VLSI (very large scale integration)

General Terms:
Design, Performance

Keywords:
RF-interconnect, chip multiprocessors, network-on-chip