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On building next generation data centers: energy flow in the information technology stack
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Annual Bangalore Compute Conference archive
Proceedings of the 1st Bangalore annual Compute conference table of contents
Bangalore, India
SESSION: Papers table of contents
Article No. 8  
Year of Publication: 2008
ISBN:978-1-59593-950-0
Authors
Ratnesh K. Sharma  Hewlett-Packard Co. Laboratories, Palo Alto, CA
Rocky Shih  Hewlett-Packard Co. Laboratories, Palo Alto, CA
Cullen Bash  Hewlett-Packard Co. Laboratories, Palo Alto, CA
Chandrakant Patel  Hewlett-Packard Co. Laboratories, Palo Alto, CA
Philip Varghese  Hewlett-Packard India Software Operations, Mahadevapura Post, Bangalore
Mohandas Mekanapurath  Hewlett-Packard India Software Operations, Mahadevapura Post, Bangalore
Sankaragopal Velayudhan  Hewlett-Packard India Software Operations, Mahadevapura Post, Bangalore
Manu Kumar, V  Hewlett-Packard India Ltd, Adugodi, Bangalore
Sponsor
: ACM Bangalore chapter
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ACM  New York, NY, USA
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ABSTRACT

The demand for data center solutions with lower total cost of ownership and lower complexity of management is driving the creation of next generation datacenters The information technology industry is in the midst of a transformation to lower the cost of operation through consolidation and better utilization of critical data center resources. Successful consolidation necessitates increasing utilization of capital intensive "always-on" data center infrastructure, and reducing the recurring cost of power. A need exists, therefore for an end to end methodology that can be used to design and manage dense data centers and determine the cost of operating a data center.

The chip core to the cooling tower model must capture the power levels and thermo-fluids behavior of chips, systems, aggregation of systems in racks, rows of racks, room flow distribution, air conditioning equipment, hydronics, vapor compression systems, pumps and heat exchangers. Earlier work has outlined the foundation for creation of a "smart" data center through use of flexible cooling resources and a distributed sensing and control system that can provision the cooling resources based on the need. This paper shows a common platform which serves as an evaluation and basis for policy based control engine for such a "smart" data center with much broader reach -- from chip core to the cooling tower. In this paper, we propose a data center solution, which has three components: Cooling, Power and Compute. These three components collectively improve efficiency and manageability of the data center by supporting greater compaction, flexible building blocks that can be dynamically configured, dynamic optimization, better monitoring and visualization, and policy-based control. Coefficient of performance (COP) of the ensemble is defined that represents an overall measure of the efficiency of performance of energy flow during the operation of a data center.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
1
The Uptime Institute, "Heat density trends in Data Processing, Computer systems and Telecommunications Equipment", White Paper issued by The Uptime Institute, 2000
 
2
Patel, C. D, Shah, A., " Cost Model for Planning, Development and Operation of a Data Center", Hewlett-Packard Laboratories Technical Report, HPL-2005-107(R.1), June 9, 2005
 
3
Thermal Guidelines for Data Processing Environments, American Society of Heating, Refrigerating and Air-Conditioning Engineers, Inc, Atlanta, 2003
 
4
C. D. Patel, "A vision of energy aware computing -- from chips to data centers", The International Symposium on Micro-Mechanical Engineering, ISMME2003-K15, December, 2003
 
5
Bash, C. E., Patel, C. D., Sharma, R. K., "Efficient Thermal Management of Data Centers -- Immediate and Long-Term Research Needs", Intl. J. HVAC&R Res., Vol.9, No.2, pp., Apr 2003
 
6
Patel, C. D., Bash, C. E., Sharma, R. K, Beitelmal, A and Friedrich, R. J., "Smart Cooling of Datacenters", Proceedings of IPACK'03 -- The PacificRim/ASME International Electronics Packaging Technical Conference and Exhibition, Kauai, HI, IPACK-35059, July 2003
 
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Sharma R, Bash, C. E, Patel, C. D, June 2002, "Dimensionless Parameters for Evaluation of Thermal Design and Performance of Large Scale Data Centers", AIAA-2002-3091, American Institute of Aeronautics and Astronautics Conference, St. Louis
 
9
Bash, C. E., Patel, Sharma, "Dynamic Thermal Management of Air-Cooled Datacenters, ASME/IEEE ITherm 2006, San Diego, CA
 
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13
Patel, C. D, Sharma, R, Bash, C. E., Beitelmal, M, "Energy Flow in the Information Technology Stack: Coefficient of Performance of the Ensemble and its Impact on the Total Cost of Ownership", HP Labs External Technical Report, HPL-2006-55, March 21, 2006


Collaborative Colleagues:
Ratnesh K. Sharma: colleagues
Rocky Shih: colleagues
Cullen Bash: colleagues
Chandrakant Patel: colleagues
Philip Varghese: colleagues
Mohandas Mekanapurath: colleagues
Sankaragopal Velayudhan: colleagues
Manu Kumar, V: colleagues