ACM Home Page
Please provide us with feedback. Feedback
Multi-layer interconnect performance corners for variation-aware timing analysis
Full text PdfPdf (182 KB)
Source International Conference on Computer Aided Design archive
Proceedings of the 2007 IEEE/ACM international conference on Computer-aided design table of contents
San Jose, California
SESSION: Variation aware timing verification table of contents
Pages 713-718  
Year of Publication: 2007
ISBN ~ ISSN:1092-3152 , 1-4244-1382-6
Authors
Frank Huebbers  Northwestern U., Evanston, IL
Ali Dasdan  Yahoo! Synnyvale, CA
Yehea Ismail  Northwestern U., Evanston, IL
Sponsors
: IEEE CASS/CANDE
SIGDA: ACM Special Interest Group on Design Automation
IEEE-CS\DATC : IEEE Computer Society
CEDA : Council on Electronic Design Automation
Publisher
IEEE Press  Piscataway, NJ, USA
Bibliometrics
Downloads (6 Weeks): 4,   Downloads (12 Months): 25,   Citation Count: 0
Additional Information:

abstract   references   collaborative colleagues  

Tools and Actions: Review this Article  

ABSTRACT

Parasitic interconnect corner methods are known to be inaccurate. This paper explains the sources of their errors and shows that errors in excess of 22% can occur in the predicted corner delays of a multi-layer stage in the presence of process variations. It is shown that exhaustive corner search methods are infeasible in practice as they have an exponential complexity in terms of required SPICE simulations with respect to the number of layers a stage is routed through. This exponential complexity is reduced to a linear one with a new simulation-based search method with the aid of stage delay properties. The ideas behind the simulation-based methodology are shown to be expandable to an analytical-based multi-layer performance corner location methodology. The simulated best/worst case delays based on these analytical corners produce errors below 4% as compared to the exhaustive search simulation based method.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
1
2
 
3
O. S. Nakagawa, N. Chang, S. Lin, and D. Sylvester, "Circuit impact on skew-corner analysis of stochastic process variation in global interconnect," in IITC, 1999, pp. 230--232.
4
 
5
S. R. Nassif, "Modeling and analysis of manufacturing variations," in Proc. of CICC, 2001, pp. 223--228.
6
 
7
 
8
9
10
 
11
Nanoscale Integration and Modeling (NIMO) Group, "Predictive technology modeling (PTM)," http://www.eas.asu.edu/~ptm, 2006.
 
12
 
13
S.-C. Wong, G.-Y. Lee, and D.-J. Ma, "Modeling of interconnect capacitance, delay, and crosstalk in VLSI," IEEE Trans. on Semicon. Manuf., vol. 13, no. 1, pp. 108--111, 2000.
 
14
W. Elmore, "The transient response of damped linear networks with particular regard to wideband amplifiers," J. of Applied Physics, vol. 19, no. 1, pp. 55--63, 1948.
 
15
K. D. Boese, A. B. Kahng, B. A. McCoy, and G. Robins, "Fidelity and near-optimality of Elmore-based routing constructions," in Proc. of ICCD, 1993, pp. 81--84.
 
16
17
18
 
19
P. K. Sancheti and S. S. Sapatnekar, "Interconnect design using convex optimization," in Proc. of CICC, 1994, pp. 549--552.
 
20
J. Nocedal and S. Wright, Numerical Optimization, 2nd ed. Springer, 2006.
 
21
T. Sakurai and A. R. Newton, "Alpha-power law mosfet model and its application to cmos inverter delay and other formulas," JSSC, vol. 25, no. 2, pp. 584--594, 1990.
Collaborative Colleagues:
Frank Huebbers: colleagues
Ali Dasdan: colleagues
Yehea Ismail: colleagues