| Optimizing wirelength and routability by searching alternative packings in floorplanning |
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ACM Transactions on Design Automation of Electronic Systems (TODAES)
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Volume 13 , Issue 1 (January 2008)
table of contents
Article No. 21
Year of Publication: 2008
ISSN:1084-4309
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Downloads (6 Weeks): 7, Downloads (12 Months): 56, Citation Count: 0
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ABSTRACT
Recent advances in VLSI technology have made optimization of the interconnect delay and routability of a circuit more important. We should consider interconnect planning as early as possible. We propose a postfloorplanning step to reduce the interconnect cost of a floorplan by searching alternative packings. If a packing contains a rectangular bounding box of a group of modules, we can rearrange the blocks in the bounding box to obtain a new floorplan with the same area, but possibly with a smaller interconnect cost. Experimental results show that we can reduce the interconnect cost of a packing without any penalty in area.
REFERENCES
Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.
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