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Optimizing wirelength and routability by searching alternative packings in floorplanning
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ACM Transactions on Design Automation of Electronic Systems (TODAES) archive
Volume 13 ,  Issue 1  (January 2008) table of contents
Article No. 21  
Year of Publication: 2008
ISSN:1084-4309
Authors
Chiu-Wing Sham  The Hong Kong Polytechnic University, Kowloon, Hong Kong
Evangeline F. Y. Young  The Chinese University of Hong Kong, NT, Hong Kong SAR
Hai Zhou  Northwestern University, Evanston, IL
Publisher
ACM  New York, NY, USA
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ABSTRACT

Recent advances in VLSI technology have made optimization of the interconnect delay and routability of a circuit more important. We should consider interconnect planning as early as possible. We propose a postfloorplanning step to reduce the interconnect cost of a floorplan by searching alternative packings. If a packing contains a rectangular bounding box of a group of modules, we can rearrange the blocks in the bounding box to obtain a new floorplan with the same area, but possibly with a smaller interconnect cost. Experimental results show that we can reduce the interconnect cost of a packing without any penalty in area.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
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Adya, S. N. and Markov, I. L. 2001. Fixed-outline floorplanning through better local search. IEEE Trans. VLSI Syst., 328--333.
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Sham, C. W. and Young, E. F. Y. 2003. Routability-Driven floorplanning with buffer planning. IEEE Trans. Comput. Aided Des. Integ. Circ. Syst., 470--480.
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Collaborative Colleagues:
Chiu-Wing Sham: colleagues
Evangeline F. Y. Young: colleagues
Hai Zhou: colleagues