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On the impact of manufacturing process variations on the lifetime of sensor networks
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International Conference on Hardware Software Codesign archive
Proceedings of the 5th IEEE/ACM international conference on Hardware/software codesign and system synthesis table of contents
Salzburg, Austria
SESSION: Case studies and emerging techniques table of contents
Pages: 203 - 208  
Year of Publication: 2007
ISBN:978-1-59593-824-4
Authors
Siddharth Garg  Carnegie Mellon University, Pittsburgh, PA
Diana Marculescu  Carnegie Mellon University, Pittsburgh, PA
Sponsors
SIGDA: ACM Special Interest Group on Design Automation
ACM: Association for Computing Machinery
SIGBED: ACM Special Interest Group on Embedded Systems
SIGMICRO: ACM Special Interest Group on Microarchitectural Research and Processing
Publisher
ACM  New York, NY, USA
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ABSTRACT

As an emerging technology, sensor networks provide the ability to accurately monitor the characteristics of wide geographical areas over long periods of time. The lifetime of individual nodes in a sensor network depends strongly on the leakage power that the nodes dissipate in the idle state, especially for low-throughput applications. With the introduction of advanced low power design techniques, such as sub-threshold voltage design styles, and the migration of fabrication processes to smaller technology generations, variability in leakage power dissipation of the sensor nodes will lead to increased variability in their lifetimes. In this paper, we analyze how this increased variability in the lifetime of individual sensor nodes affects the performance and lifetime of the network as a whole. We demonstrate how sensor network designers can use the proposed analysis framework to trade-off the cost of a sensor network deployment with the performance it offers. Our results indicate that up to 37% improvement in the critical lifetime of a sensor network (defined as the expected time at which the sensor network becomes disconnected) can be obtained over a baseline design with a 20% increase in the cost of the individual sensor nodes.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
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Collaborative Colleagues:
Siddharth Garg: colleagues
Diana Marculescu: colleagues