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Temperature-aware processor frequency assignment for MPSoCs using convex optimization
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International Conference on Hardware Software Codesign archive
Proceedings of the 5th IEEE/ACM international conference on Hardware/software codesign and system synthesis table of contents
Salzburg, Austria
SESSION: Low power design and thermal control table of contents
Pages: 111 - 116  
Year of Publication: 2007
ISBN:978-1-59593-824-4
Authors
Srinivasan Murali  EPFL, Lausanne, Switzerland
Almir Mutapcic  Stanford University, Stanford, CA
David Atienza  EPFL, Lausanne, Switzerland
Rajesh Gupta  UC San Diego, San Diego, CA
Stephen Boyd  Stanford University, Stanford, CA
Giovanni De Micheli  EPFL, Lausanne, Switzerland
Sponsors
SIGDA: ACM Special Interest Group on Design Automation
ACM: Association for Computing Machinery
SIGBED: ACM Special Interest Group on Embedded Systems
SIGMICRO: ACM Special Interest Group on Microarchitectural Research and Processing
Publisher
ACM  New York, NY, USA
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Downloads (6 Weeks): 20,   Downloads (12 Months): 140,   Citation Count: 7
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ABSTRACT

The increasing processing capability of Multi-Processor Systems-on-Chips (MPSoCs) is leading to an increase in chip power dissipation, which in turn leads to significant increase in chip temperature. An important challenge facing the MPSoC designers is to achieve the highest performance system operation that satisfies the temperature and power consumption constraints. The frequency of operation of the different processors and the application workload assignment play a critical role in determining the performance, power consumption and temperature profile of the MPSoC. In this paper, we propose novel convex optimization based methods that solve this important problem of temperature-aware processor frequency assignment, such that the total system performance is maximized and the temperature and power constraints are met. We perform experiments on several realistic SoC benchmarks using a cycle-accurate FPGA-based thermal emulation platform, which show that the systems designed using our methods meet the temperature and power consumption requirements at all time instances, while achieving maximum performance.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
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CITED BY  7

Collaborative Colleagues:
Srinivasan Murali: colleagues
Almir Mutapcic: colleagues
David Atienza: colleagues
Rajesh Gupta: colleagues
Stephen Boyd: colleagues
Giovanni De Micheli: colleagues