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Measuring performance, power, and temperature from real processors
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Source Workshop On Experimental Computer Science archive
Proceedings of the 2007 workshop on Experimental computer science table of contents
San Diego, California
Article No. 16  
Year of Publication: 2007
ISBN:978-1-59593-751-3
Authors
Francisco J. Mesa-Martinez  University of California, Santa Cruz
Michael Brown  University of California, Santa Cruz
Joseph Nayfach-Battilana  University of California, Santa Cruz
Jose Renau  University of California, Santa Cruz
Publisher
ACM  New York, NY, USA
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ABSTRACT

The modeling of power and thermal behavior of processors requires challenging validation processes, which may be complex and undependable. In order to ameliorate some of the difficulties associated with the validation of power and thermal models, this paper describes an infrared measurement setup that simultaneously captures run-time power consumption, thermal characteristics, and performance activity counters from modern processors. We use infrared cameras with high spatial resolution (10x10/μm) and high frame rate (125Hz) to capture thermal maps. Power measurements are obtained with a multimeter, while performance counters are obtained after modifying the operating system (Linux), both at a sampling rate of 1KHz. The synchronized traces can then be used in the validation process of possible thermal, power, and processor activity models.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
1
BIOS and Kernel Developer's Guide for AMD Athlon 64 and AMD Opteron Processors. Advanced Micro Devices, Inc., Apr 2004.
2
 
3
 
4
Y. K. Cheng, P. Raha, C. C. Teng, E. Rosenbaum, and S. M. Kang. ILLIADS-T: An Electrothermal Timing Simulator for Temperature-Sensitive Reliability Diagnosis of CMOS VLSI Chips. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 17(8):1434--1445, Aug 1998.
 
5
Sung Woo Chung and K. Skadron. Using On-Chip Event Counters For High-Resolution, Real-Time Temperature Measurement. In Thermal and Thermomechanical Phenomena in Electronics Systems, 2006, pages 114--120. IEEE Computer Society, May 2006.
 
6
 
7
H. F. Hamann, J. Lacey, A. Weger, and J. Wakil. Spatially-resolved imaging of microprocessor power (SIMP): hotspots in microprocessors. In Thermal and Thermomechanical Phenomena in Electronics Systems, 2006, pages 121--125. IEEE Computer Society, May 2006.
 
8
9
10
11
 
12
S. Wilton and N. Jouppi. CACTI: An Enhanced Cache Access and Cycle Time Model. IEEE Journal on Solid-State Circuits, 31(5):677--688, May 1996.
 
13
Y. Zhang, D. Parikh, K. Sankaranarayanan, K. Skadron, and M. Stan. Hotleakage: A temperature-aware model of subthreshold and gate leakage for architects. Technical Report CS-2003-05, Univ. of Virginia Dept. of Computer Science, March 2003.

Collaborative Colleagues:
Francisco J. Mesa-Martinez: colleagues
Michael Brown: colleagues
Joseph Nayfach-Battilana: colleagues
Jose Renau: colleagues