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Off-chip decoupling capacitor allocation for chip package co-design
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Source Annual ACM IEEE Design Automation Conference archive
Proceedings of the 44th annual Design Automation Conference table of contents
San Diego, California
SESSION: 3D IC and package design issues table of contents
Pages: 618 - 621  
Year of Publication: 2007
ISBN ~ ISSN:0738-100X , 978-1-59593-627-1
Authors
Hao Yu  Berkeley-DA Inc., Santa Clara, CA
Chunta Chu  UCLA, Los Angeles, CA
Lei He  UCLA, Los Angeles, CA
Sponsors
: The EDA Consortium
: IEEE/CASS/CANDE/CEDA
SIGDA: ACM Special Interest Group on Design Automation
Publisher
ACM  New York, NY, USA
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ABSTRACT

Off-chip decoupling capacitor (decap) allocation is a demanding task during package and chip codesign. Existing approaches can not handle large numbers of I/O counts and large numbers of legal decap positions. In this paper, we propose a fast decoupling capacitor allocation method. By applying a spectral clustering, a small amount of principal I/Os can be found. Accordingly, the large power supply network is partitioned into several blocks each with only one principal I/O. This enables a localized macromodeling for each block by a triangular-structured reduction. In addition, to systemically consider a large legal position map in a manageable fashion, the map of legal positions is decomposed into multiple rings, which are further parameterized in each block. The decaps are then allocated according to the sensitivity obtained from the parameterized macro-model for each block. Compared to the PRIMA-based macromodeling, experiments show that our method (TBS2) is 25X faster and has 3.04X smaller error. Moreover, our decap allocation reduces the optimization time by 97X, and reduces decap cost by up to 16% to meet the same power-integrty target.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
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H. Zheng and et. al., "On-package decoupling optimization with package macromodels," in Proc. CICC, 2003.
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C. Ding, "Spectral clustering, principal component analysis and matrix factorizations for learning," in Int't Conf. on Machine Learning (Tutorial), 2005.
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