| An integer linear programming based routing algorithm for flip-chip design |
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Annual ACM IEEE Design Automation Conference
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Proceedings of the 44th annual Design Automation Conference
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San Diego, California
SESSION: 3D IC and package design issues
table of contents
Pages: 606 - 611
Year of Publication: 2007
ISBN ~ ISSN:0738-100X , 978-1-59593-627-1
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Downloads (6 Weeks): 6, Downloads (12 Months): 61, Citation Count: 10
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ABSTRACT
The flip-chip package provides a high chip-density solution to the demand for more I/O pads of VLSI designs. In this paper, we present the first routing algorithm in the literature for the pre-assignment flip-chip routing problem with a pre-defined netlist among pads and wire-width and signal-skew considerations. Our algorithm is based on integer linear programming (ILP) and guarantees to find an optimal solution for the addressed problem. It adopts a two-stage technique of global routing followed by detailed routing. In global routing, it first uses two reduction techniques to prune redundant solutions and create a global-routing path for each net. Without loss of the solution optimality, our reduction techniques can further prune the ILP variables (constraints) by 85.5% (98.0%) on average over a recent reduction technique. The detailed routing applies X-based grid-less routing to complete the routing. Experimental results based on five real industry designs show that our router can achieve 100% routability and the optimal global-routing wirelength and satisfy all signal-skew constraints, under reasonable CPU times, while recent related work results in much inferior solution quality.
REFERENCES
Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.
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Jia-Wei Fang , I-Jye Lin , Ping-Hung Yuh , Yao-Wen Chang , Jyh-Herng Wang, A routing algorithm for flip-chip design, Proceedings of the 2005 IEEE/ACM International conference on Computer-aided design, p.753-758, November 06-10, 2005, San Jose, CA
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UMC, "0.13μm flip-chip layout guideline," p. 6, 2004.
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CITED BY 10
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Shenghua Liu , Guoqiang Chen , Tom Tong Jing , Lei He , Tianpei Zhang , Robi Dutta , Xian-Long Hong, Topological routing to maximize routability for package substrate, Proceedings of the 45th annual conference on Design automation, June 08-13, 2008, Anaheim, California
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Shenghua Liu , Guoqiang Chen , Tom Tong Jing , Lei He , Tianpei Zhang , Robi Dutta , Xian-Long Hong, Substrate topological routing for high-density packages, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, v.28 n.2, p.207-216, February 2009
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