Efficient transient simulation of lossy interconnect

Subscribe (Full Service)


	Search: The ACM Digital Library The Guide

	Feedback

Efficient transient simulation of lossy interconnect

Full text

Pdf (639 KB)

Source

Annual ACM IEEE Design Automation Conference archive
Proceedings of the 28th ACM/IEEE Design Automation Conference table of contents

San Francisco, California, United States

Pages: 740 - 745

Year of Publication: 1991

ISBN:0-89791-395-7

Authors

Jaijeet S. Roychowdhury	Department of Electrical Engineering and Computer Sciences, University of California, Berkeley
Donald O. Pederson	Department of Electrical Engineering and Computer Sciences, University of California, Berkeley

Sponsors

SIGDA: ACM Special Interest Group on Design Automation
IEEE-CS : Computer Society

Publisher

ACM New York, NY, USA

Bibliometrics

Downloads (6 Weeks): 11, Downloads (12 Months): 56, Citation Count: 11

Additional Information:

references cited by index terms collaborative colleagues

Tools and Actions:	Request Permissions Review this Article Save this Article to a Binder Display Formats: BibTeX EndNote ACM Ref

DOI Bookmark:	Use this link to bookmark this Article: http://doi.acm.org/10.1145/127601.127762 What is a DOI?

REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

	1	C.W. Ho et. al. The Thin Film Module as a High Performance Semiconductor Package. IBM J. Res. Dev., 26(3), May 1982.
	2	C.A. Neugebauer et. al. High Performance Interconnections between VLSI Chips. Solid State Tech., June 1988.
	3	A.J. BlodgettJr. A Multilayer Ceramic Multichip Module. IEEE Trans. Compon. Hyb. Manuf. Tech., CHMT- 3(4), December 1980.
	4	B.T. Clark and Y.M. Hill. IBM Multichip Multilayer Ceramic Modules for LSI Chips- Design for Performance and Density. IEEE Trans. Compon. Hyb. Manuf Tech., CHMT-3(1), March 1980.
	5	D. Nayak et. al. Calculation of Electrical Parameters of a Thin-Film Multichip Package. IEEE Trans. Compon. Hyb. Manuf. Tech., 12(2):303-309,June 1989.
	6	A. Deutsch , G. V. Kopcsay , V. A. Ranieri , J. K. Cataldo , E. A. Galligan , W. S. Graham , R. P. McGouey , S. L. Nunes , J. R. Paraszczak , J. J. Ritsko , R. J. Serino , D. Y. Shih , J. S. Wilczynski, High-speed signal propagation on lossy transmission lines, IBM Journal of Research and Development, v.34 n.4, p.601-615, Jul. 1990
	7	L-T. Hwang et. al. The Effects of the Skin-Depth on the Design of a Thin-Film Package. Source unknown. The authors are with MCNC, Research Triangle Park, NC.
	8	J.S. Roychowdhury and A. R. Newton. Algorithms for the Transient Simulation of Lossy Interconnect. in preparation.
	9	K.D. Marx and R.I. Eastin. A Configuration Oriented Spice Model for Multiconductor Transmission Lines with Homogeneous Dielectrics. IEEE Trans. Microwave Th. Tech., to appear.
	10	K.D. Marx. Propagation Modes, Equivalent Circuits, and Characteristic Terminations for Multiconductor Transmission Lines with Inhomogeneous Dielectrics. IEEE Trans. Microwave Th. Tech., MTI'-21(7), July 1973.
	11	F. Romeo and M. Santomauro. Time-domain Simulation of n Coupled Transmission Lines. IEEE Trans. Microwave Th. Tech., MTT-35, February 1987.
	12	J.E. Schutt-Aine andR. Mittra. Analysis of Pulse Propagation in Coupled Transmission Lines. IEEE Trans. Ckts. Sys., CAS-32(12), December 1985.
	13	L.W. Nagel. SPICE2: a computer program to simulate semiconductor circuits. PhD thesis, EECS Dept., Univ. Calif., Berkeley, Elec. Res. Lab., 1975. Memorandum no. ERL-M520.
	14	H.W. Dommel. Digital Computer Solution of Electromagnetic Transients in Single and Multiphase Networks. IEEE Trans. Power App. Sys., PAS-88(4):388, April 1969.
	15	A.j. Gruodis. Transient Analysis of Uniform Resistive Transmission Lines in a Homogeneous Medium. IBM J. Res. Dev., 23(6), November 1979.
	16	A.R. Djordjevi6 and T.K. Sarkar. Analysis of Time Response of Lossy Multiconductor Transmission Line Networks. IEEE Trans. Microwave Th. Tech., MTT- 35( 10):898, October 1987.
	17	R. Wang and O. Wing. Analysis of VLSI Multiconductor Systems by Bi-Level Waveform Relaxation. In Proc. ICCAD 90, pages 166-169, 1990.
	18	A.R. Djordjevi6 et. al. Analysis of Lossy Transmission Lines with Arbitrary Nonlinear Terminal Networks. IEEE Trans. Microwave Th. Tech., MTI'-34(6):660, June 1986.
	19	A.R. Djordjevi6 et. al. Time-Domain Response of Multiconductor Transmission Lines. Proc. IEEE, 75(6):743, June 1987.
	20	J.E. Schutt-Aine and R. Mittra. Scattering Parameter Transient Analysis of Transmission Lines loaded with Nonlinear Terminations. IEEE Trans. Microwave Th. Tech., MTT-36:529-536, 1988.
	21	J.E. Schutt-Aine and R. Mittra. Nonlinear Transient Analysis of Coupled Transmission Lines. IEEE Trans. Ckts. Sys., 36(7), July 1989.
	22	Leon O. Chua , Paul Y. Lin, Computer-Aided Analysis of Electronic Circuits: Algorithms and Computational Techniques, Prentice Hall Professional Technical Reference, 1975
	23	C. William Gear, Numerical Initial Value Problems in Ordinary Differential Equations, Prentice Hall PTR, Upper Saddle River, NJ, 1971
	24	A.G. Webster. Partial Differential Equations of Mathematical Physics. Dover Publications, 1955.
	25	Thomas Linwood Quarles , A. Richard Newton, Analysis of performance and convergence issues for circuit simulation, 1989

CITED BY 11

	J. S. Roychowdhury , A. R. Newton , D. O. Pederson, Simulating lossy interconnect with high frequency nonidealities in linear time, Proceedings of the 29th ACM/IEEE conference on Design automation, p.75-80, June 08-12, 1992, Anaheim, California, United States
	Monjurul Haque , Ali El-Zein , S. Chowdhury, A new time-domain macromodel for transient simulation of uniform/nonuniform multiconductor transmission-line interconnections, Proceedings of the 31st annual conference on Design automation, p.628-633, June 06-10, 1994, San Diego, California, United States
	Sudhakar Muddu , Andrew B. Kahng, Optimal equivalent circuits for interconnect delay calculations using moments, Proceedings of the conference on European design automation, p.164-169, September 19-23, 1994, Grenoble, France
	S. Lin , E. S. Kuh, Transient simulation of lossy interconnect, Proceedings of the 29th ACM/IEEE conference on Design automation, p.81-86, June 08-12, 1992, Anaheim, California, United States
	Monjurul Haque , S. Chowdhury, Analysis and reliable design of ECL circuits with distributed RLC interconnections, Proceedings of the 30th international conference on Design automation, p.697-701, June 14-18, 1993, Dallas, Texas, United States
	Jaijeet S. Roychowdhury , A. Richard Newton , Donald O. Pederson, An exact analytic technique for simulating uniform RC lines, Proceedings of the conference on European design automation, p.416-420, November 1992, Congress Centrum Hamburg, Hamburg, Germany
	Dinesh Pamunuwa , Li-Rong Zheng , Hannu Tenhunen, Maximizing throughput over parallel wire structures in the deep submicrometer regime, IEEE Transactions on Very Large Scale Integration (VLSI) Systems, v.11 n.2, p.224-243, April 2003
	J. E. Bracken , V. Raghavan , R. A. Rohrer, Extension of the asymptotic waveform evaluation technique with the method of characteristics, Proceedings of the 1992 IEEE/ACM international conference on Computer-aided design, p.71-75, November 1992, Santa Clara, California, United States
	Shen Lin , Ernest S. Kuh, Transient simulation of lossy coupled transmission lines, Proceedings of the conference on European design automation, p.126-131, November 1992, Congress Centrum Hamburg, Hamburg, Germany
	V. Raghavan , J. E. Bracken , R. A. Rohrer, AWESpice: a general tool for the accurate and efficient simulation of interconnect problems, Proceedings of the 29th ACM/IEEE conference on Design automation, p.87-92, June 08-12, 1992, Anaheim, California, United States
	Valentina Cecchi , Aaron St. Leger , Karen Miu , Chika Nwankpa, Loading studies for power transmission line models in the presence of non-fundamental frequencies, Proceedings of the 2007 summer computer simulation conference, July 16-19, 2007, San Diego, California