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Temperature aware task scheduling in MPSoCs
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Source Design, Automation, and Test in Europe archive
Proceedings of the conference on Design, automation and test in Europe table of contents
Nice, France
SESSION: Impact of nanometer technologies in MPSoCs and SoC design table of contents
Pages: 1659 - 1664  
Year of Publication: 2007
ISBN:978-3-9810801-2-4
Authors
Ayse Kivilcim Coskun  University of California, San Diego
Tajana Simunic Rosing  University of California, San Diego
Keith Whisnant  Sun Microsystems, San Diego
Sponsors
: IEEE Council on Electronic Design Automation (CEDA)
SIGDA: ACM Special Interest Group on Design Automation
: The EDA Consortium
EDAA : European Design and Automation Association
RAS : RAS
: The IEEE Computer Society TTTC
: ECSI
Publisher
EDA Consortium  San Jose, CA, USA
Bibliometrics
Downloads (6 Weeks): 29,   Downloads (12 Months): 186,   Citation Count: 12
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ABSTRACT

In deep submicron circuits, elevation in temperatures has brought new challenges in reliability, timing, performance, cooling costs and leakage power. Conventional thermal management techniques sacrifice performance to control the thermal behavior by slowing down or turning off the processors when a critical temperature threshold is exceeded. Moreover, studies have shown that in addition to high temperatures, temporal and spatial variations in temperature impact system reliability. In this work, we explore the benefits of thermally aware task scheduling for multiprocessor systems-on-a-chip (MPSoC). We design and evaluate OS-level dynamic scheduling policies with negligible performance overhead. We show that, using simple to implement policies that make decisions based on temperature measurements, better temporal and spatial thermal profiles can be achieved in comparison to state-of-art schedulers. We also enhance reactive strategies such as dynamic thread migration with our scheduling policies. This way, hot spots and temperature variations are decreased, and the performance cost is significantly reduced.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
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CITED BY  12
Collaborative Colleagues:
Ayse Kivilcim Coskun: colleagues
Tajana Simunic Rosing: colleagues
Keith Whisnant: colleagues